Recent #AMD news in the semiconductor industry

12 months ago

➀ AMD is considering 'multi-chip stacking' for its future Ryzen SoC to achieve chip scalability.

➁ AMD has been committed to innovating its existing consumer CPU product lines, being the first to introduce a dedicated '3D V-Cache' module (known as the 'X3D' product line) in processors.

➂ A new patent application suggests AMD is exploring a 'novel packaging design' that aims to innovate chip stacking processes, ultimately reducing interconnect latency and bringing significant performance improvements.

AMD
12 months ago
➀ AMD believes the new Ryzen 7 9800X3D's overclocking capabilities will encourage gamers to upgrade from the previous Ryzen 7 7800X3D model; ➁ The 'overclocking factor' of the 9800X3D is expected to drive some 7800X3D owners to consider the new CPU; ➂ Martijn Boonstra, AMD's Product and Business Development Manager, highlighted the overclocking potential of the 9800X3D in an interview with PC Guide.
AMDCPURyzen 7gamingoverclocking
12 months ago
➀ WSTS报告2024年第三季度半导体市场增长1660亿美元,同比增长10.7%;➁ 英伟达因AI GPU的强劲表现成为最大半导体公司;➂ 2024年第四季度展望显示数据中心市场将推动Nvidia、美光和AMD的收入增长;➃ 2025年展望显示AI将推动服务器增长,但增速将放缓。
AIAMDAutomotive IndustryInfineon TechnologiesLight Vehicle ProductionMarket GrowthMediaTekMemory MarketMicron TechnologyNVIDIANXP SemiconductorsPCsQualcommRenesas ElectronicsSEMICONDUCTORSK hynixSTMicroelectronicsSmartphonesTexas Instruments
12 months ago
➀ AMD's unreleased UDNA GPU architecture is expected to be released in Q2 2026; ➁ AMD is moving towards a unified architecture, dropping separate RDNA and CDNA; ➂ The first gaming GPUs based on UDNA will be the MI400 data centre GPUs and the RX 9000 series, with mass production scheduled for Q2 2026.
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