<p>➀ AMD is considering 'multi-chip stacking' for its future Ryzen SoC to achieve chip scalability.</p><p>➁ AMD has been committed to innovating its existing consumer CPU product lines, being the first to introduce a dedicated '3D V-Cache' module (known as the 'X3D' product line) in processors.</p><p>➂ A new patent application suggests AMD is exploring a 'novel packaging design' that aims to innovate chip stacking processes, ultimately reducing interconnect latency and bringing significant performance improvements.</p>