➀ Infineon launches PSOC 4100T Plus, an Arm Cortex-M0+ MCU integrating Multi-Sense technology for HMI applications, with 128K Flash and 32K SRAM;

➁ The MCU supports capacitive/inductive sensing, ML-based liquid level detection, and hover touch, enabling versatile roles as a standalone controller or an HMI interface chip;

➂ Targets user-friendly interfaces for industrial and consumer systems through advanced sensing and system control capabilities.

➀ Leibniz Universität Hannover (LUH) secured funding for three Excellence Clusters (PhoenixD, QuantumFrontiers, Hearing4all.connects), enabling its bid for "Excellence University" status by 2026;

➁ PhoenixD advances photonics for medical and quantum applications, QuantumFrontiers pioneers quantum metrology and next-gen sensors, and Hearing4all.connects integrates AI and genetics to enhance hearing health solutions;

➂ The clusters emphasize interdisciplinary collaboration with academic and industry partners, reinforcing LUH's leadership in cutting-edge research.

➀ Introduces the book 'Our Robotics Future' exploring automation, robotics and AI's transformative impact;

➁ Examines implications for businesses, workers and consumers in an automated world;

➂ Positioned as a guide to understand technological shifts driven by emerging technologies

➀ Longsys showcased cutting-edge storage solutions at COMPUTEX 2025, targeting AI PCs and servers with products like the 8TB QLC PCIe SSD and industrial-grade BGA SSD;

➁ The company introduced its full-stack AI storage ecosystem, including QLC eMMC for edge AI and enterprise solutions like MRDIMM and Gen4 eSSD to address AI cluster bottlenecks;

➂ Longsys emphasized its PTM business model, offering end-to-end storage foundry services with firmware customization, rigorous testing, and dedicated production lines for diverse industrial applications.

➀ The ViTFOX project, led by Fraunhofer IPMS and European-Korean partners, develops a Vision-Transformer (ViT) architecture using ferroelectric oxides to achieve AI energy efficiency exceeding 50 TOPS/W for edge applications;

➁ The project integrates computing-in-memory technology to reduce latency and energy consumption, leveraging ferroelectric materials like HZO compatible with silicon-based devices;

➂ Cross-border collaboration aims to advance semiconductor innovation, combining European expertise in epitaxial ferroelectric junctions with Korean 3D FeRAM development to enhance hardware-software co-optimization.

➀ Semtech launches the LR2021 transceiver, the first chip in the LoRa Plus family with fourth-generation LoRa IP, supporting terrestrial and satellite networks across Sub-GHz, 2.4 GHz ISM, and licensed S-band frequencies.

➁ The chip enables AI edge devices with low power consumption, extended range, and penetration, supporting applications like gunshot detection and image transfer at up to 2.6 Mbps data rates while reducing BOM costs and PCB footprint.

➂ Backward-compatible with LoRaWAN and compatible with protocols like Amazon Sidewalk and Z-Wave, it simplifies multi-region deployment via a single-SKU design and enhances IoT connectivity for diverse applications.

➀ Phison launched the E28 PCIe 5.0 SSD controller, the first with integrated AI processing, built on TSMC's 6nm process, achieving 2.6M/3M IOPS and 15% lower power consumption;

➁ It includes AI acceleration to reduce AI training time by 50% and targets AI servers and workstations, not consumer devices;

➂ Future iterations may improve random performance for general PCs, offering up to 240% faster speeds than current gaming SSDs.

➀ Ambiq collaborates with CardioMedive to launch the Medive platform, a modular health monitoring system powered by ultra-low-power Apollo510 microcontrollers;

➁ The platform integrates edge AI for real-time cardiovascular insights, supporting ECG, blood pressure, SpO₂, and temperature monitoring with up to weeks of continuous operation;

➂ Dual SDIO interfaces enable simultaneous Wi-Fi connectivity and local data storage, enhancing medical diagnostics in clinical and home settings while minimizing cloud dependency.

➀ The Fraunhofer IST is advancing simulation tools to bridge the gap between theoretical models and industrial applications, aiming to reduce physical experiments and enhance efficiency in processes like vacuum coating and water treatment;

➁ The institute plans to integrate AI, machine learning, and digital twins to make simulations accessible to non-experts, expanding beyond its established PICMC/DSMC and CFD modeling techniques;

➂ Fraunhofer IST emphasizes workforce training through partnerships with universities like TU Braunschweig, fostering a new generation skilled in simulation-based decision-making for sustainable industrial practices.

➀ Intel launched new Arc Pro B-Series GPUs (B60 and B50) and Gaudi 3 AI accelerators for professional workloads;

➁ These tools target AI inference and tasks in engineering, design, and media with scalable configurations;

➂ Intel released an open-source AI Assistant Builder on GitHub to simplify AI agent development for its hardware.

➀ Nvidia and Infineon collaborate to develop a centralized 800V HVDC power architecture for AI data centers, aiming to replace decentralized AC/DC systems and reduce energy losses;

➀ The new approach minimizes power conversion stages, improves efficiency, and supports higher power densities (projected over 1MW per rack by 2030), critical for large-scale AI workloads involving 100,000+ GPUs;

➂ Centralized HVDC enhances scalability, reliability, and sustainability while meeting the performance demands of next-gen AI infrastructure.

➀ AMD unveils Radeon AI Pro R9700 at Computex 2025, targeting professional AI workloads with RDNA 4 architecture and Navi 48 chip;

➁ Features 32GB GDDR6, 640GB/s bandwidth, and 1,531 TOPS AI性能，宣称在Llama 8B等模型上比RTX 5080快5倍;

➂ Set for July 2025 launch with multi-GPU支持，但价格未公布，直面NVIDIA的专业级挑战。

➀ AMD unveiled its next-gen Radeon RX 9060 XT GPU with 16GB VRAM and Threadripper Pro 9000 CPUs featuring up to 96 cores at Computex 2025.

➁ The livestream faced multiple technical interruptions, including freezes and outages, sparking humorous speculation among viewers.

➂ AMD showcased AI-driven innovations like real-time medical imaging analysis, voice translation tools, and FSR 'Redstone' for enhanced gaming graphics.

➀ Gartner highlights eight key supply chain trends, including ambient invisible intelligence using smart sensors for real-time tracking and environmental compliance;

➁ Adoption of polyfunctional robots and autonomous data collection (e.g., drones) to optimize warehouse efficiency and reduce labor costs;

➂ AI-driven decision intelligence and intelligent simulation integrate analytics and machine learning to enhance decision-making and operational adaptability in logistics.

➀ Q1 2025 electronics sales declined 16% QoQ but stayed flat YoY, while IC sales dipped 2% QoQ but surged 23% YoY, fueled by AI and high-performance computing investments;

➁ Semiconductor CapEx fell 7% QoQ but rose 27% YoY, driven by investments in HBM, advanced packaging, and wafer fab equipment (WFE) spending growth;

➂ Global wafer fab capacity expanded to 42.5 million wafers/quarter, with China, Japan, and Taiwan leading growth amid geopolitical risks and uncertain trade policies.

➀ Foxconn and NVIDIA are partnering to deploy an 'AI factory supercomputer' in Taiwan, in collaboration with the Taiwan government.

➁ The system will feature 10,000 GPUs based on NVIDIA's Blackwell architecture.

➂ The goal is to accelerate automation and efficiency across various key segments, including smart cities, electric vehicles, and manufacturing.

➀ Qualcomm announced at Computex 2025 its plans to enter the server market with new data center CPUs and AI inference accelerators, focusing on energy efficiency as a key differentiator;

➁ The upcoming hardware includes a server-grade CPU compatible with NVIDIA's NVLink Fusion, indicating collaboration in heterogeneous computing architectures;

➂ This move expands Qualcomm's reach beyond client devices, leveraging its Nuvia-acquired expertise to challenge Intel and AMD in the lucrative data center sector.

➀ Intel announced Arc Pro B50 (16GB VRAM, $299) and B60 (24GB VRAM, $500) GPUs at Computex 2025, targeting AI inference workloads;

➁ Partner systems like Maxsun's dual-GPU B60 design and Project Battlematrix workstations ($5K-$10K) showcase scalability for large AI models;

➂ Q3 2025 launch with phased software support, claiming 2.6X performance over gaming drivers and 2.7X AI gains vs NVIDIA's Ada GPUs.

➀ NVIDIA announced the upgraded Grace Blackwell Ultra GPU (GB300) shipping in Q3 2025, alongside new AI infrastructure advancements;

➁ The RTX Pro Server system delivers 4x H100 performance for DeepSeek and 1.7x gains for Llama models, with NVLink Fusion enabling cross-company hardware compatibility;

➂ Future plans include the Feynman architecture (2028) and immediate production of the DGX Spark workstation, offering 1,000 AI TOPS for researchers.

➀ Intel showcased fully functional Panther Lake Core Ultra 300 laptop chips at Computex 2025, powered by the groundbreaking 18A process, slated for early 2026 release;

➁ Demonstrated AI workloads including live Python game coding with Clippy AI model and Da Vinci video editing with real-time AI effects, though specific metrics remain under wraps;

➂ Revealed advanced packaging with CPU/GPU/SoC tiles and hinted at Xe3 iGPU architecture positioning between Lunar/Arrow Lake, signaling Intel's multi-die integration maturity.