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May 29
- i.MX 91 Cortex-A55 in 37 x 39mm system-on-module
➀ Myir launched a 37x39mm system-on-module (SoM) with NXP's i.MX 91 processor (1.4GHz Arm Cortex-A55 core), targeting applications like EV charging stations, smart homes, and industrial gateways;
➁ The module integrates 1GB LPDDR4 RAM, 8GB eMMC, and extensive interfaces (USB, Ethernet, CAN-FD, etc.), supporting Linux 6.6.36;
➂ A development board (MYD-LMX91) is available with M.2 slots, WiFi, and an optional 7-inch LCD for rapid prototyping.
- What caught your eye? (AI, EDA ban, Cheri MCU, Rosetta Stone payload)
➀ U.S. President Trump imposed a ban on the sale of EDA tools to China, impacting semiconductor industry relations;
➁ SCI Semiconductor secured £2.5 million funding for developing a secure microcontroller based on the 'Cheri' architecture, backed by Microsoft and Google, which enhances hardware security through metadata-bound memory pointers;
➂ iSpace EUROPE plans to deliver a UNESCO cultural heritage payload, the "Memory Disc V3," to the Moon via a lunar micro-rover, symbolizing a modern Rosetta Stone mission.
- Allegro adds Cortex-M4 to 90V motor driver ICs
➀ Allegro Microsystems launched standalone three-phase automotive brushless motor driver ICs with a 40MHz Arm Cortex-M4 core, supporting up to 90V rails and targeting external n-channel MOSFET control;
➁ The ICs feature 12-bit PWM, multiple ADCs, serial communication, and internal voltage regulation, available in 7x7mm QFN packages with variants for 60V/90V and different flash/I/O configurations;
➂ Debugging tools from Segger now support these ICs, and Allegro previously released non-MCU motor drivers and sensors in April 2025.
- DevBoard Watch: PocketBeagle 2 targets IoT, robotics, prototyping
➀ The PocketBeagle 2, a quad-core development board based on TI's AM6254 SoC, is introduced as an upgrade with 1.4GHz cores, a 3D GPU, and a Cortex-M4F processor;
➁ It targets applications in IoT, robotics, and prototyping;
➂ The board remains compact, following the PocketBeagle form factor for accessibility in embedded projects.
- SI forecasts 7% semi growth for 2025
➀ Q1 2025 semiconductor revenues reached $167.7 billion, up 18.8% YoY but down 2.8% QoQ, with mixed performance among major companies—NVIDIA rose 12% while STMicroelectronics and Kioxia saw >20% declines;
➁ Economic uncertainty and tariffs are dampening outlooks, though AI demand boosts NVIDIA and memory firms (e.g., SK Hynix expects 14.6% Q2 growth), while automotive and smartphone markets slow;
➂ Semiconductor Intelligence forecasts 7% 2025 growth, citing tariff risks potentially lowering TechInsights' projection from 14% to 2%, with weakness likely extending to 2026.
May 28
- 100mm single board computers get Intel Core 3
➀ Aaeon launched two compact single board computers (Up Squared TWL and Pro TWL) with Intel Twin Lake Core 3 N355/N250/N150 CPUs;
➀ The Up Squared TWL (85.6 x 90mm) supports LPDDR5 up to 16GB, 128GB eMMC, M.2 storage, and Wi-Fi; its Pro variant (101.6 x 101.6mm) adds SATA SSD, 5G/LTE, and MIPI camera interfaces;
➂ Both feature industrial-grade durability (-20 to 70°C operation), 2.5G Ethernet, multi-display outputs, and compatibility with Windows 11/Ubuntu/Yocto OS.
- 1.2kV 260A three-phase silicon carbide power module
➀ Rhopoint Components introduces the CMT-PLA3SB12340, a 1.2kV 260A three-phase SiC power module capable of delivering up to 340A at 25°C for electric vehicles;
➁ The module offers 5kV isolation, integrated gate driver power supplies, fault flags, and requires only 12V-18V input with PWM signals;
➂ Designed for automotive and industrial applications, it features compact dimensions (104 x 154 x 34mm), thermal management (0.183°C/W), and operates at -40°C to +175°C.
- Wide-range ac-dc converter works over 18-264Vac, or 18-375Vdc
➀ Recom launched a compact 15W AC-DC converter (RAC15-xxSK/WI series) with an ultra-wide input range of 18-264V AC or 18-375V DC, available in five output voltages (5V to 54V).
➁ The module achieves ~82% efficiency, delivers full 15W output above 48V AC, and operates reliably at up to 85°C ambient temperature under convection cooling, meeting reinforced isolation and Class B EMC standards.
➂ Designed for applications with variable input voltages or multi-region compatibility, it supports industrial and household uses per UL/IEC/EN 62368-1 and IEC 60335-1 certifications.
- A Daunting Prospect For Intel and Samsung
➀ TSMC’s advanced roadmap for the decade positions it as the dominant leader in leading-edge logic manufacturing, creating pressure on Intel and Samsung;
➁ Intel and Samsung’s high-risk bets on GAA, BSPD, and high-NA EUV technologies failed to surpass TSMC, leaving the latter as the sole trusted choice for cutting-edge foundry services;
➂ TSMC’s execution excellence has led to a de facto monopoly, raising industry concerns about reduced competition despite its reputation for fairness and responsibility.
- EnSilica opens Cambridge hub, adds engineers
➀ EnSilica, a mixed-signal ASIC specialist, established a new engineering hub in Cambridge and recruited six engineers (including four PhD holders), expanding its global workforce to 190;
➁ The expansion strengthens its mmWave/RF IC design capabilities to meet rising customer demand in satellite and communications markets;
➂ Supported by UK Space Agency funding and contract wins, the move aims to attract talent and capitalize on growth opportunities.
- Reuters: Solar inverters with undocumented cellular interfaces
➀ Solar inverters and energy storage batteries contain undocumented cellular communication interfaces, potentially enabling covert remote access;
➀ Reuters reports unidentified manufacturers, with concerns these interfaces could bypass security firewalls in critical power infrastructure;
➂ The discovery highlights cybersecurity risks but lacks specifics on exploit incidents or responsible parties.
- TSMC dazzles in Amsterdam
➀ TSMC showcased its advanced semiconductor technologies at the 2025 Europe Symposium, highlighting N3 nodes' high-volume production with variants for CPUs, cost-effective products, and automotive applications;
➁ Unveiled next-gen N2 and A16/A14 processes with performance/efficiency improvements, and introduced CFET transistor designs achieving double density;
➂ Demonstrated 3D Fabric innovations (SoIC/CoWoS), wafer-scale AI systems (SoW-X), and specialized automotive/IoT solutions including RRAM/MRAM and N4C RF for emerging wireless standards.
- TSMC to open European Design Centre (EUDC) in Q3
➀ TSMC will establish its European Design Centre (EUDC) in Munich in Q3 2025 to support European customers in designing high-performance, energy-efficient chips for automotive, AI, IoT, and industrial applications;
➁ The center aims to drive process technology development, foster expertise in automotive and non-volatile memory (e.g., RRAM/MRAM), and collaborate with global design teams;
➂ The EUDC will join TSMC's global network, enhancing chip design innovation and strengthening industry partnerships across key sectors.
- EV bloodbath looms in China
➀ BYD slashed prices of its Seagull and Seal 07 DM-i models by 34% and $7,400 respectively, sparking a fierce price war in China's automotive sector;
➁ Rivals like Geely and Great Wall Motor retaliated with price cuts, potentially forcing over 100 smaller competitors out of the market;
➂ BYD's aggressive domestic pricing strategy, coupled with plans to expand overseas sales to 800,000 units, could disrupt global markets despite EU tariffs on Chinese EVs.
- ESA, CTO plan space-based 5G mmWave connectivity tests
➀ The European Space Agency (ESA) and Constellation Technologies & Operations (CTO) are collaborating on testing 5G mmWave connectivity in low Earth orbit using a pathfinder satellite set for launch in June 2025;
➁ The experiments aim to validate interoperability between space and terrestrial networks, enabling cost-effective hybrid connectivity solutions;
➂ The initiative aligns with ESA's strategy to strengthen European sovereignty in space technology and advance 3GPP-compliant Non-Terrestrial Networks (NTN).
- Top Ten (less 5) AR/VR Headset Vendors
➀ The article highlights the market shares of the top five AR/VR headset vendors in 2025, according to IDC data;
➀ Meta dominates the market with an overwhelming 74.6% share, followed by Apple (5.2%), Sony (4.3%), ByteDance (4.1%), and XREAL (3.3%);
➂ The piece also lists recommended articles on supply chain trends, engineer wealth, and unconventional tech ideas.
May 27
- Nvidia 800Vdc data centre
➀ NVIDIA collaborates with Texas Instruments, Infineon, STMicroelectronics, and others to advance 800Vdc power architecture for AI data centers;
➁ 800Vdc distribution aims to improve power density by 85% and efficiency via dc-dc conversion, supporting future 1MW AI server racks;
➂ The project involves power component leaders like Delta, Schneider Electric, and Navitas to optimize energy infrastructure.
- Dyson launches Pencilback Fluffycones
➀ Dyson launched the Pencilback Fluffycones, the industry's slimmest cordless vacuum cleaner, featuring a 38mm diameter and 1.8kg weight;
➁ It includes a 360-degree rotating brush to prevent hair tangling, edge-cleaning design, and green LED illumination for dust detection;
➂ Powered by a 28mm Hyperdimium motor spinning at 140,000 RPM, offering powerful suction and compact performance.
- Foxconn said to be bidding for Singapore’s UTAC to expand OSAT capability
➀ Foxconn is reportedly bidding to acquire Singapore-based semiconductor test and assembly company UTAC, owned by China's Wise Road Capital, for up to $3 billion;
➁ UTAC operates facilities in Singapore, China, Indonesia, and Thailand, with annual EBITDA estimated at $300 million;
➂ Foxconn is expanding globally, including a $433 million India JV with HCL Technologies and discussions for a €250 million packaging plant in France with Radiall and Thales.
- Boxing Robots
➀ Unitree Robotics showcased its humanoid G1 robots at the China Media Group World Robot Competition in Hangzhou, where they engaged in boxing matches;
➁ The G1 model stands 4'3", weighs 35kg, offers a 2-hour battery life, and costs over $16k;
➂ Founded in 2016 by Wang Xingxing, Unitree also produces affordable robotic dogs like the XDog, priced at $1,600.
- MOV Adopts Solid State Device Strategy
➀ MO Valve Company shifts focus to industrial solid-state devices up to 6000 Mc/s, prioritizing communication bandwidth over high-power applications;
➁ An export division is established, with microwave equipment attracting attention in Paris, aiming for a 40% export share including indirect quotas;
➂ The company abandons domestic market products (e.g., color TVs) and concentrates on industrial valves, thyratrons, and cathode ray tubes, affirming valves' continued relevance.
- £2.5m towards UK’s CHERI-secured MCU
➀ UK start-up SCI Semiconductor raised £2.5 million to develop a CHERI-based secure microcontroller aimed at preventing memory-related cyber attacks;
➁ The funding, supported by NPIF II and angel investors, will expand its engineering team in Sheffield and advance its 32-bit RISC-V core with hardware-enforced memory safety;
➂ The first CHERI-enabled IC is set for release in 2025, with Google Research as an early customer, promising compliance with stringent cybersecurity regulations.
May 26
- EV Foreign Market Penetration
➀ Most EVs in China, North America, the EU, and APAC are produced domestically, though North America and the EU see increasing foreign competition;
➁ Tesla and Ford expanded EU-based EV production in 2024, while some European companies faced stagnant domestic output;
➂ U.S. EV production declined by 7%, offset by growth in Mexico (U.S.-led), while China exports EVs and others rely on imports.
- Glass microfibres in textiles use acoustic waves to measure touch, pressure and movement
➀ ETH Zurich researchers developed smart textiles (SonoTextiles) using glass microfibers to conduct acoustic waves instead of electronics for touch and motion sensing;
➁ Changes in acoustic wave frequencies (around 100 kHz) indicate movement, pressure, or touch, enabling low-computing-power data processing;
➂ Woven glass fibers with transmitters and receivers detect disruptions caused by body movements or breathing, expanding wearable tech applications.
- Q1 NEV sales up 39% y-oy
➀ Q1 2025 global NEV sales surged 39% YoY to 4.02 million units, with BEVs growing 45% (2.67 million units) and PHEVs up 28% (1.35 million units).
➁ BYD led BEV sales with 15.4% market share, surpassing Tesla (12.6%), while Xiaomi debuted at 8th place. Geely saw a 443% YoY spike in BEV sales, and Volkswagen rose 41% among non-Chinese brands.
➂ Despite growth, some Chinese brands like AITO and Lynk & Co faced declines. TrendForce forecasts 2025 NEV sales to reach 19.47 million units, up 19.6% YoY.
- Q1 Mobile Core Market Up 32% YoY
➀ Q1 2025 Mobile Core Network (MCN) market surged 32% YoY, led by China's 122% growth and 12% growth in non-China regions.
➀ Growth drivers include 5G Standalone (SA) network expansion, replacement of VNFs with CNFs, and subscriber migration from 4G to 5G, with ZTE benefiting from major projects in China.
➂ Dell’Oro forecasts 5G MCN market growth of 15% YoY in 2025, with Huawei, ZTE, Ericsson, and Nokia leading vendor rankings globally and regionally.
- LG demos IoT-NTN vehicle bringing emergency calls to streets of Paris
➀ LG demonstrated its IoT-NTN technology in Paris, featuring AI-powered voice compression for seamless switching between terrestrial and satellite networks.
➁ The system enables real-time emergency voice calls via a single button, enhancing safety and connectivity in remote or disaster-affected areas.
➂ IoT-NTN supports applications like autonomous driving and integrates with 5GAA's C-V2X initiatives, with satellite D2D convergence under 3GPP standards.
- Ed Goes For Reconfigurables
➀ Ed proposes a £20 million UK government prize for developing reconfigurable AI chip prototypes to address AI progress bottlenecks;
➁ The UK leverages Arm’s low-power design expertise, university photonics, packaging technologies, and phase-change materials research;
➂ HMG plans funding for a collaborative research hub, imec access, and manufacturing partnerships, with Ed positioning himself in profit-generating oversight roles.
May 23
- Most Read – GaN micro-LEDs, Rivian contract, Nvidia’s Blackwell Ultra
➀ Nvidia announced the Grace Blackwell Ultra AI chip (GB300) shipping in Q3 and a 4x performance boost in its RTX Pro Server for AI models;
➁ Nvidia and Infineon collaborated on centralized 800V HVDC power architecture for AI data centers to optimize space and efficiency;
➂ Wolfspeed faces bankruptcy due to $6.5B debt and loss of key clients like Tesla and Volkswagen, reducing its SiC market share from 32% to 19%.
- Imec and MIT join forces for non-invasive diagnostic devices
➀ Imec and MIT collaborate on nanoelectronics-based solutions for minimally invasive diagnostic devices to advance personalized medicine;
➁ The partnership combines MIT's expertise in healthcare microsystems and imec's semiconductor technology leadership, aiming to develop clinical and home-use monitoring devices;
➂ AI-integrated data from these devices will generate digital biological profiles to empower disease diagnosis, therapy, and prevention.