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June 4
- Soitec and PSMC hook up for TLT wafers
➀ Soitec collaborates with PSMC to supply TLT-ready wafers for advanced 3D chip stacking, marking the first public reveal of its TLT technology；
➁ The technology enables ultra-thin transistor layer transfers (5nm-1µm), enhancing chip power efficiency and supporting vertical architectures like backside power delivery；
➂ Utilizes Smart Cut and IR laser processing to lift layers without thermal stress, advancing applications in AI, autonomous driving, and mobile devices.
- Imec fabs Ru lines at 16nm pitch with low resistance
➀ Imec fabricated Ruthenium (Ru) interconnects at a 16nm pitch using a semi-damascene process, achieving record-low resistance of 656Ω/µm;
➁ The integration flow combined EUV-based SADP and optimized Ru etching to enhance cost-effectiveness and yield, with 90%+ yields at 18-22nm pitches;
➂ Imec is advancing pillar-based self-aligned vias and epitaxial Ru films to further reduce resistance and expand multi-layer interconnect scalability.
- RUSI report highlights UK ‘defence dividend’ for local areas
➀ The RUSI report emphasizes the UK defense industry's role in driving economic growth, supporting 1 in 60 jobs and boosting local economies through higher-than-average salaries and multiplier effects;
➀ Leonardo's UK operations, such as its Yeovil site, highlight significant wage disparities (average £51,000 vs. local £32,000) and job creation through supply chains;
➂ The UK's strategic defense review prioritizes increased spending (2.5% GDP by 2027) and integration of AI, drones, and digital warfare to enhance military capabilities.
- Top Ten (less 5) Enterprise WLAN Companies
➀ The article lists the top five enterprise WLAN vendors based on IDC's report, though specific company names are not disclosed;
➁ It highlights the significance of enterprise WLAN technology in modern networking infrastructure;
➂ The content is part of David Manners' 'Mannerisms' series, which often covers industry trends and market analyses.
June 3
- Elektra Awards 2025 looking for tech stars – companies, entrepreneurs and designers
➀ The Elektra Awards 2025 is inviting global electronics industry innovators, with new categories highlighting entrepreneurial talent (under 35), impactful start-ups, and workplace excellence;
➁ Specialized awards focus on neurodiversity products (e.g., sensory aids), futurist prototypes (like haptic sneakers), and IoT-driven smart building solutions;
➂ Free submissions are open until June 13, with additional categories spanning automotive, medical, consumer tech, and Manufacturer of the Year.
- GMSL automotive bus gets an industry association as ‘OpenGMSL’
➀ The GMSL automotive serial bus is standardized as OpenGMSL with the creation of the OpenGMSL Association (OGA), aiming to drive innovation in autonomous driving, ADAS, and infotainment;
➀ Founding members include Analog Devices, Qualcomm, TDK, and over 20 other global companies, ensuring multi-vendor interoperability through compliance testing;
➂ The technology supports ASIL B safety standards, real-time diagnostics, and combines video, data, and power transmission on a single channel for automotive applications.
- How To Be MEGA
➀ The MEGA project, a 1983 collaboration between Philips and Siemens, aimed to advance Europe's semiconductor industry by developing a Megabit DRAM to compete with US and Japanese rivals.
➁ Jurgen Knorr of Siemens emphasized the necessity of mass production and cost-effectiveness for competitiveness, highlighting Europe's historical lag in adopting standardized, high-volume manufacturing strategies.
➂ The article critiques Europe's neglect of these principles, leading to challenges from Chinese semiconductor firms offering mature, cost-effective technologies.
- Video: Silicon Motion showcases AI and Industrial innovations
➀ Silicon Motion SVP Robert Fan discusses the company's latest storage and display solutions for AI, industrial, and embedded applications at Embedded World 2025;
➁ Key products include PCIe NVMe SSD controllers, Ferri embedded storage, SM770 multi-display SoC, and the MonTitan 128TB QLC SSD, emphasizing performance and energy efficiency;
➂ The innovations target high reliability for diverse industries, reinforcing Silicon Motion's position in AI-driven storage technology.
- Qorvo front end for WiFi 7
➀ Qorvo launched the QPF4557 integrated front-end module for Wi-Fi 7, optimizing power efficiency and performance through a 5V supply and digital pre-distortion technology.
➁ The module supports a wide bandwidth (5.125 to 5.925 GHz) and integrates components like a power amplifier, switch, coupler, and low-noise amplifier into one device.
➂ It aims to enhance throughput, reduce power consumption, and minimize layout area for advanced Wi-Fi 7 systems.
- Dual Audio Operational Amplifier with JFET input
➀ Nisshinbo Micro Devices introduced the NL8902 dual audio operational amplifier with "MUSES" technology, featuring JFET input and high-performance specs;
➁ Key specifications include 10 nV/√Hz noise, 0.0004% distortion, 20 V/µs slew rate, 9 MHz bandwidth, and 82 dB EMI rejection, operating at ±4-16V;
➂ Designed for consumer audio, professional equipment, and automotive systems, available in EMP-8-AN and DFN4035-8-GR packages.
- Wishful Thinking
➀ John G McDonald's 1960 article in Electronics Weekly predicted that rapid transportation advancements (e.g., jets) would accelerate global economic integration and competition;
➁ He highlighted the European Common Market's potential as an economic bloc rivaling the U.S., driving industrial consolidation and stronger international competitiveness;
➂ McDonald foresaw challenges in military coordination and urged foreign companies to establish local bases to adapt to the shifting economic landscape.
- Picture of the Day: “Holographic truck” and its rotating LEDs
➀ The article features a 'holographic truck' claimed as the world's first 3D holographic experience truck, utilizing rotating LEDs to create immersive visual effects;
➀ The innovation was highlighted by AV Magazine, emphasizing its unique application of holographic technology in a mobile format;
➂ The truck’s debut location remains unspecified, but its blend of automotive and advanced display technology showcases experimental semiconductor-driven solutions.
June 2
- How Hard Can It Be?
➀ The article features Nvidia CEO Jensen Huang discussing his approach to expanding the company into new technological frontiers, such as supercomputers and robotics;
➁ Nvidia is transitioning from chip manufacturing to providing integrated solutions, including servers, data centers, and advanced computing systems;
➂ Huang highlights his leadership philosophy of driving innovation and motivating his team to embrace ambitious goals in emerging markets.
- Anglia signs Alliance for legacy memory
➀ Anglia Components partners with Alliance Memory to supply legacy and new memory products, including SRAM, DRAM, and Flash;
➁ The products serve as drop-in replacements for devices from major brands like Micron and Samsung, targeting industries such as IoT, communications, and industrial markets;
➂ The collaboration emphasizes competitive pricing, secure inventory, and addressing End-of-Life (EOL) challenges for customers.
- AccelerComm raises $15m
➀ AccelerComm secured $15 million in funding to advance its 5G satellite communication technology for Direct-to-Device (D2D) connectivity between phones and satellites;
➁ The investment round was led by IP Group, with participation from IQ Capital, Swisscom Ventures, and Bloc Ventures, aiming to accelerate product deployments;
➂ Collaborating with Lockheed Martin, the company's technology will power the first regenerative 5G NTN payload in orbit, endorsed by the UK Space Agency for expanding global mobile coverage.
- Intel and Softbank explore alternative to HBM
➀ Intel and SoftBank jointly established Saimemory to develop a stacked DRAM technology as an alternative to HBM, aiming to reduce power consumption by half;
➁ A prototype is expected within two years, with production targeted by the end of the decade, supported by $70 million in total investment, including $21 million from SoftBank;
➂ The technology originated from Intel, Japanese academia, and partners like Riken and Shinko Electric, with potential government funding and priority supply for SoftBank's AI processors (e.g., Arm and Graphcore).
- TSMC talking about building fabs in the UAE
➀ TSMC is exploring plans to build six advanced fabs in the UAE, potentially costing over $200 billion, amid U.S. security concerns over technology leaks to China;
➁ The U.S. and UAE negotiated agreements to align cybersecurity protocols, including safeguards for U.S.-origin tech, as part of a deal for a large AI datacenter in Abu Dhabi using 500,000 Nvidia chips;
➂ Political tensions persist, with U.S. officials wary of the UAE fab project’s sensitivity compared to TSMC’s $165 billion Arizona fabs.
- Scepticism for EU startup plan
➀ The EU's 'Startup and Scaleup Strategy' aims to boost Europe's startup ecosystem through reduced bureaucracy, a €10 billion fund, and cross-border support, but faces skepticism;
➁ Critics argue over-regulation of AI and tech, fragmented policies, funding limitations, and rigid startup definitions hinder innovation, prompting concerns about talent and investment leaving Europe;
➂ Europe's emphasis on tech regulation clashes with innovation needs, potentially forcing a critical choice between regulatory control and fostering technological advancement.
- 2025 PC market forecast to grow 4.1% y-o-y
➀ IDC forecasts a 4.1% year-over-year growth for the PC market in 2025, with volumes reaching 274 million units;
➁ A slight contraction is expected in 2026 due to Windows 11 migration stabilization and tougher comparisons against 2025's strong performance;
➂ SMB-driven upgrades are identified as a key growth driver in the second half of 2025.
- Ed Makes A Play For The AI Datacentre Market
➀ UK Minister Ed initiates a strategy to position the country in the AI datacentre market by fostering photonics-based interconnection startups through collaborations with universities and industry players;
➀ Plans global networking trips to tech hubs (e.g., Las Vegas, Singapore) funded by the UK government, accompanied by startup executives, to attract investors and partners, despite criticism over the lavish itinerary;
➁ Develops a comprehensive promotional campaign involving white papers, social media engagement, and CEO mentorship to transform startups into thought leaders, while positioning himself to profit personally from the AI datacentre boom.
- UKESF takes first STEP for Semiconductor: Skills, Talent and Education Programme
➀ UKESF launches £4.75 million Semiconductor STEP program, funded by the UK政府, to address critical skills shortages in the semiconductor sector through targeted education and training initiatives;
➁ The program includes four projects: Semiconductor Skills in Schools, Semiconductor Talent Award, Semiconductor Skills Development Course, and Semiconductor Skills for Physics Graduates, focusing on K-12 outreach, university scholarships, design training, and post-graduate upskilling;
➂ Aligned with the UK’s 2023 Semiconductor Strategy, the one-year initiative aims to build a sustainable talent pipeline, with potential for extended funding amid ongoing government reviews.
May 30
- Linear RF amplifier covers 3.3 – 4.2GHz
➀ Mouser Electronics now stocks Qorvo's QPA9822 linear RF amplifier, designed for 5G mMIMO systems in the 3.3-4.2GHz N77 band with 530MHz bandwidth;
➁ The device offers 38dB gain, 29dBm P3dB output power, operates at 5V, and uses a compact 3x3mm surface-mount package with integrated 50Ω matching;
➂ Despite being announced over a year ago, Qorvo has not released the full datasheet, while DigiKey recently expanded its partnership with Qorvo for RF component distribution.
- CHIIPS podcast features insights from Katalytik’s Jan Peters
➀ The latest CHIIPS podcast features Jan Peters from Katalytik discussing the importance of communication and teamwork in engineering;
➁ She shares insights on turning engineering concepts into reality and strategies to avoid manufacturing challenges;
➂ Peters, a STEM advocate and recipient of the 2024 Elektra Educational Support Award, highlights her role in fostering industry connections and supporting technical education.
- Tiny inductor-inclusive nano-power dc-dc IC
➀ Torex Semiconductor developed the XCL108, a nano-power boost DC-DC converter with an integrated inductor, requiring only 400nA quiescent current and operating from inputs as low as 650mV;
➁ It features fixed output voltages (3V to 5.5V) and high efficiency (up to 90.6%), using PWM-PFM control for optimal performance across load conditions;
➂ The ultra-compact 2.5x2x1mm package integrates critical components, enabling a total footprint of 7.7x3.1mm with external capacitors, ideal for space-constrained applications.
- Modular SiC inverter modules accompanied by reference designs
➀ Cissoid and Rhopoint Components collaborate to provide modular SiC-based intelligent power modules and inverter control platforms with reference designs for customization;
➁ Target applications include electric vehicles (cars, buses, trucks) and heavy-duty industrial equipment, aviation, and marine systems;
➂ The 1200V SiC MOSFET modules support up to 340A continuous current, operate at -40°C to 175°C, and offer open-source customization to accelerate development timelines.
- Most Read – 800Vdc data centres, CHERI-secured MCU, Foxconn bid
➀ Foxconn is reportedly bidding for Singapore-based UTAC to expand chip packaging capabilities, with a potential $3 billion deal;
➁ UK startup SCI Semiconductor raised £2.5M to develop CHERI-based secure microcontrollers, planning to expand its team in Sheffield;
➂ Nvidia partnered with Texas Instruments for 800Vdc data centers to enhance AI processor power efficiency, while Renesas abandoned SiC market plans due to Wolfspeed’s instability, and Dyson launched a slim vacuum cleaner with improved hair-cleaning features.
- Taoglas adds Thunder
➀ Taoglas launches Thunder Series, an outdoor antenna enclosure integrating industrial routers to reduce cabling and deployment costs;
➁ The solution supports 5G/4G, Wi-Fi, and Bluetooth across 600-6000MHz, leveraging co-located routers and antennas for minimized signal loss;
➂ IP67-rated directional/omnidirectional variants enable harsh-environment applications in smart cities, mining, and transportation systems.
- 2025 smartphone market to grow 0.6% y-o-y
➀ IDC forecasts 0.6% YoY growth in 2025 smartphone shipments to 1.24 billion units, citing market saturation and longer refresh cycles;
➁ China's 3% growth is driven by government subsidies benefiting Android, while Apple faces a 1.9% decline due to Huawei competition and subsidy ineligibility;
➂ The US market grows 1.9% despite trade war impacts, mitigated by carrier deals and premium device launches in late 2025.
- Q1 high end router market shows first growth since Q2 2023
➀ The Q1 2025 high-end router market achieved its first year-over-year growth since Q2 2023, rising 10% with strong performance across all segments, especially in service provider Core and Edge Routers;
➁ Huawei led the market with a 23% revenue surge, gaining 3% market share, while Juniper and Nokia grew 16% and 14% respectively, but Cisco declined despite growth in Core Router sales driven by its RON solutions;
➂ Market uncertainty remains due to potential U.S. government policies that could increase costs and hinder economic expansion.
May 29
- Fable: A Reffing Cock-Up With A Happy Ending
➀ A disputed goal in an 1889 football match between Everton and Accrington led to an engineer witnessing a referee's incorrect decision;
➁ The engineer, later a prominent civil engineer, invented a solution to prevent future disputes over goal decisions;
➂ The story emphasizes that short-term injustices can drive long-term innovations.