➀ HPE introduces the Slingshot 400 switch with liquid cooling and 51.2Tbps speed; ➁ The switch is designed for HPE's liquid-cooled supercomputing platforms; ➂ The new switch aims to provide faster HPC interconnect speeds to keep pace with AI cluster solutions like NVIDIA Spectrum-X.
Recent #Networking news in the semiconductor industry
➀ Samtec展示了224 Gbps PAM4速度的先进互连平台解决方案；➁ 2024年Samtec面临的最大挑战是满足超大规模企业对GPU和AI加速器的快速增长需求；➂ 预计2025年微同轴和双绞铜电缆的制造以及公司光收发器产品的扩展将实现显著增长。
➀ Introduces the Dynalink AXE10200 Wi-Fi 6E Whole Home Mesh System; ➁ Discusses the benefits of a mesh system for eliminating Wi-Fi dead zones; ➂ Highlights the features of the Dynalink AXE10200, such as high-speed Wi-Fi 6E technology, coverage, and security.
➀ Enfabrica ACF-S, a Multi-Tbps SuperNIC, has been showcased at OCP Summit 2024; ➁ The chip integrates PCIe links and network links, aiming to improve network efficiency in GPU servers; ➂ The chip is expected to impact the future of GPU servers.
➀ The Elektra Awards 2024 is just a few weeks away with only two Premium Tables remaining. The event will take place on December 10th at the IET London, Savoy Place. ➁ There are no Standard Tables left, making this the last chance to secure a seat with a view. ➂ Book your place now as individual seats are limited.
➀ The iKoolCore R2 Max is reviewed as an interesting mini PC with dual 10Gbase-T, dual 2.5GbE NICs, and dual M.2 SSDs. It features an Alder Lake-N CPU and offers both fan and fanless options. The review highlights its performance and versatility. ➁ The device is compared to similar models, with the N100 starting at $299 and the Core i3-N305 at $399. The review mentions the challenges with FreeBSD support for the Marvell NIC driver. ➂ The iKoolCore R2 Max is praised for its network connectivity and dual display support, with the ability to run two 4K60 displays.
➀ The Tenda TEM2010F review details its features, performance, and price; ➁ The switch offers 8 2.5GbE ports and 2 SFP ports with a 50Gbps switching capacity; ➂ It was priced significantly lower than expected, making it a cost-effective option in the market.
➀ The MikroTik CRS304-4XG-IN is a cost-effective 10Gbase-T switch with a MSRP of $199; ➁ It offers four 10Gbase-T ports and one management port, making it a versatile networking solution; ➂ The review highlights its affordability, performance, and ease of use.
➀ Large cluster scale;
➁ High computing density;
➂ Large-scale deployment of cold plate liquid cooling;
➃ Network card and Roce networking solution;
➄ Switch model and specifications;
➅ Modular maintenance of GPU servers;
➆ Cabinet color indicator lights;
➇ The need for general-purpose servers;
➈ Importance of storage systems;
➍ Power supply guarantee system;
➎ Ongoing expansion of cluster scale.
➀ Meta's new FBNIC adapter, co-developed with Marvell, supports up to four hosts with 4x 100G connections and 400Gbps bandwidth; ➁ The adapter is based on the OCP NIC 3.0 design with a SFF form factor and Ejector Latch for easy serviceability; ➂ Meta showcases the architecture and driver availability for Linux Kernel 6.11.
➀ Wi-Fi 6 and 7 are advancing wireless technology with improved speed, efficiency, and low latency, addressing modern connectivity needs. ➁ The article highlights the features of Wi-Fi 6 and 7, such as OFDMA, MU-MIMO, TWT, and MLO, and their impact on IoT and smart homes. ➂ It discusses the challenges and future adoption of Wi-Fi 7, emphasizing the importance of RF design, power efficiency, and thermal management.
➀ Meta Minipack3, a key switch from Meta, was showcased at the OCP Summit 2024. It features 64 OSFP ports and uses 800G optics. The switch is designed by Broadcom and manufactured by Celestica, with a target noise level of 78dba. It can provide up to 128-ports of 400GbE and operates at under 2100W, showcasing the efficiency of co-packaged optics solutions. ➁ Meta's Minipack line has been a popular choice for networking infrastructure, with this new version offering significant advancements. ➂ The trend towards 400GbE is evident, with Meta leading the way in deploying such high-speed switches for AI clusters and fast remote storage.
➀ Micas Networks showcased the Broadcom Tomahawk 5 CPO switch at OCP Summit 2024, featuring 128x 400GbE ports and pluggable light sources. ➁ The switch, with a liquid cooling loop, was actively running traffic on the show floor. ➂ The design is expected to be influential in the adoption of co-packaged optics technology.
➀ Soft NoC tiling is supported by Arteris's FlexNoC, designed for AI and multicore chips; ➁ It differs from hard tiling in its flexibility and adaptability; ➂ Hard tiling is less flexible and is typically used for specific chip layouts.
➀ Delta demonstrated a Broadcom 128-port 400GbE Co-Packaged Optics Switch at OCP Summit 2024; ➁ The switch features 128x 400GbE ports and external pluggable light sources; ➂ The pluggable modules enhance switch reliability and ease of maintenance.
The Fraunhofer Heinrich-Hertz-Institut (HHI) has launched the HYPERCORE project, aimed at developing energy-efficient, secure, and high-performance communication infrastructure for the hyper-connected society. The project, funded by the German Federal Ministry of Education and Research (BMBF), focuses on optimizing metro and core networks, exploring a combination of all three physical dimensions (time, frequency, and space) for increasing transmission capacity. The project involves developing multiband transmission systems, coherent OTDR systems for network control, and expanding digital twin technology for optical communication networks. Field tests are planned for 2026 in Kiel and Berlin.
➀ The logic relationship between network cards, smart network cards, and DPUs;
➁ The reasons for the emergence of smart network cards and DPUs;
➂ The advantages of DPU over smart network cards;
➃ Product information of NVIDIA's BlueField-3 DPU;
➄ On-chip system layout of BlueField-3 DPU;
➅ Typical application scenarios of BlueField-3 DPU;
➆ Example of BlueField-3 DPU in VMware private cloud;
➇ NVIDIA's DPU roadmap.
➀ Xscape Photonics has secured $44 million in Series A funding; ➁ The round was led by IAG Capital Partners; ➂ Cisco Systems Inc. and Nvidia Corp. participated in the round.