➀ The 'Microtec Academy' is established to address the growing demand for skilled workers in microelectronics and microsystem technology. ➁ The project is coordinated by the Ferdinand-Braun-Institut (FBH) and is part of the 'skills4chips' initiative, which aims to strengthen Germany's position in microelectronics. ➂ The project focuses on providing tailored training programs and new digital solutions to support flexible learning and attract skilled workers.
Recent #Microelectronics news in the semiconductor industry
➀ The German federal project 'skills4chips' aims to secure skilled professionals for the semiconductor industry by establishing a national educational academy. ➁ The 'Microtec Academy' is set to respond to the growing demand for skilled workers and will be coordinated by the Berlin Ferdinand-Braun-Institut. ➂ The project, which is funded by the Federal Ministry of Education and Research, will focus on upskilling and reskilling in microelectronics and microsystem technology, with a budget of 12 million euros over four years.
➀ Researchers at Argonne National Laboratory have discovered how ferroelectric materials adapt their structures under light pulses, offering a new way to build power-saving microelectronics. ➁ This adaptation mirrors the plasticity of neural networks, leading to new data processing techniques with lower energy consumption. ➂ The advancement could lead to significant reductions in power consumption for supercomputers and data centers, benefiting industries reliant on high-performance computing.
➀ The Research Factory of Microelectronics Germany (FMD) awarded the 'Green ICT Award' for outstanding theses in sustainable ICT. The award promotes interest in sustainable microelectronics and provides a platform for young researchers.➁ Joseph Winkler won first place with his thesis on high-efficiency 48V DC-DC converter design.➂ The award ceremony took place during the Green ICT Connect conference, which focuses on sustainable microelectronics and innovation.
➀ The Fraunhofer IZM coordinates a project to develop new simulation models for microelectronics. ➁ These models aim to replace costly qualification tests with faster and more flexible simulations. ➂ The project, named mikroVAL, uses advanced modeling principles and protects intellectual property while enabling reusability of models.
New Simulation Models Bring Complex Microelectronics Products to Market Faster and More Economically
➀ The Fraunhofer IZM leads a project to develop new simulation models for microelectronics reliability testing; ➁ The project aims to reduce the time and cost of qualification tests through advanced simulation techniques; ➂ The models will be reusable and adaptable to more complex systems, enhancing reliability without compromising accuracy.
➀ Wuxi is known as the 'Huang埔 Military Academy' of China's integrated circuit industry, with a significant influence and nurturing power in the field. It has produced a large number of talents for the Chinese semiconductor industry. ➁ Wuxi's 742 Factory played a crucial role in China's integrated circuit development, introducing advanced technology from Japan and becoming a 'King of Chips'. ➂ The construction of Wuxi Microelectronics Engineering marked a turning point in China's microelectronics industry, demonstrating the city's dedication and ingenuity. ➃ Wuxi has established a complete industry chain with over 400 integrated circuit enterprises, making it one of the cities with the most complete integrated circuit industry chain in China.
➀ The Fraunhofer Institutes IMS and FHR have qualified for the second competitive round of the Fraunhofer Society's performance centers with their work on 'Terahertz sensor technology'. The participation is associated with a 3 million Euro grant from January 1, 2025, to December 31, 2027. ➁ The need for bandwidth is the main driver for Terahertz (THz) technologies, as modern applications like cloud computing or artificial intelligence require ever higher data transmission rates. ➂ With the funding from the Fraunhofer Society, the two participating institutes can establish a center over the next three years that focuses on chip development and the transfer of all related manufacturing and evaluation steps to the finished MMIC.
➀ The Green ICT Connect event, organized by FMD, focuses on sustainable information and communication technology. It brings together industry, science, and politics for discussions and networking.➁ The event includes the second Green ICT Awards ceremony and an exclusive breakfast for female scientists.➂ The FMD promotes sustainability in microelectronics and encourages women in the field through various initiatives and events.
➀ The U.S. Chips Act awards $5 million to 17 small businesses for metrology projects under the SBIR Programme; ➁ The funding aims to establish the merit, feasibility, and commercial potential of the proposed projects; ➂ The recipients include companies focused on high-speed cameras, EUV lithography, cryogenic systems, thermal analysis, and semiconductor fabrication equipment among others.
➀ Intel is set to receive up to $3 billion in funding for the Secure Enclave program; ➁ The program aims to bolster the trusted production of advanced chips on Intel's 18A process technology for U.S. government use; ➂ Intel's partnership with the DoD dates back to 2020 and includes contributions to the SHIP program.
1. Professor Dr Ulrike Ganesh appointed as Co-Director of Fraunhofer IZM, joining Professor Martin Schneider-Ramelow. 2. Ganesh brings extensive experience in semiconductor technology and leadership from roles at IBM, Qualcomm, and Bosch. 3. The duo aims to address complex challenges in microelectronics and enhance Germany's competitive edge in the field.
1. Prof. Ulrike Ganesh has been appointed as the co-lead of Fraunhofer IZM, complementing Prof. Martin Schneider-Ramelow's leadership. 2. Both professors bring extensive expertise in microelectronics and semiconductor technologies. 3. Their combined leadership aims to drive innovative solutions and enhance Germany's competitiveness in microelectronics.
1. Scientists from TU Berlin and Fraunhofer IZM have modeled the mechanical damage during the shear test to better understand the process. 2. New wire materials with an aluminum-coated copper core or aluminum-magnesium alloys are more resistant than pure aluminum wires. 3. The existing shear codes for standard thick wires cannot be directly applied to these new materials, necessitating new evaluation guidelines.
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