1. TSMC's first European fab in Germany, co-owned with Bosch, Infineon, and NXP, will focus on automotive and industrial chips, with production starting in 2027. 2. Partnerships with Samsung and SK Hynix aim to leverage TSMC's expertise, enhancing faster processing speeds. 3. TSMC's strategic investments and collaborations underscore its commitment to innovation and leadership in the semiconductor market.

➀ Intel CEO Pat Gelsinger outlines the future direction following a board meeting; ➁ Plans to establish Intel Foundry as an independent subsidiary; ➂ Maintains current leadership team and adds independent directors for governance; ➃ Continues Smart Capital approach for financial flexibility; ➄ Adjusts manufacturing expansion plans and delays projects in Poland and Germany; ➅ Expands in Europe through Ireland and maintains commitment to U.S. manufacturing investments.

➀ Intel has secured AWS as a customer for its 18A process; ➁ The collaboration involves co-investment in custom chip designs; ➂ Intel will produce an AI fabric chip for AWS and a custom Xeon 6 chip on Intel 3.

➀ Intel is establishing a foundry subsidiary and has announced a significant win with AWS, involving a multi-year, multi-billion-dollar deal for custom chip designs and wafers. ➁ Intel is receiving up to $3 billion from the US government through the CHIPS Act. ➂ Intel is planning to restructure its foundry business as a subsidiary to enhance independence and focus on capital efficiency. ➃ The company is also focusing on streamlining its product portfolio, integrating software and incubation businesses, and reducing workforce.

➀ The article discusses the role of Industry 4.0 in addressing climate change challenges through sustainable solutions. ➁ It emphasizes the importance of interoperable digital ecosystems for enhancing the resilience of the value chain and technological sovereignty. ➂ The author highlights the need for lifelong learning and the role of augmented and virtual reality in the future of work and production processes.

➀ The REAL-M project, set to launch on September 25th, aims to revolutionize manufacturing with a flexible production cell. It showcases the potential of multi-robot solutions for medium-sized enterprises. The key concept is teamwork, where robots will collaborate with humans and each other directly rather than through fixed transfer stations. ➁ The REAL-M facility, located in the Chemnitz research factory of Fraunhofer IWU, features a modern, multi-layered control architecture and a digital twin of the multi-robot cell for virtual commissioning. ➂ The REAL-M enables simulations with multiple interacting robots, allowing for realistic testing of production processes and reducing the time from order to production (Time-to-Manufacturing).

1. DN Solutions has introduced the new DNX series, a multitasking machine designed for mass appeal; 2. The DNX series includes the DNX 2100SB and DNX 2100S models, aiming to simplify complex machining processes and increase productivity; 3. The company has also established a new design identity for the product, with a focus on sleek curves and the signature DN Blue color, and is showcasing the DNX series and other solutions at major international trade shows.

➀ Tokyo Electron and Tata Electronics announced a strategic collaboration for semiconductor equipment supply and workforce training; ➁ The partnership aims to build a dynamic ecosystem for timely execution of fab and advanced packaging factories; ➂ Tokyo Electron will train Tata Electronics' workforce on its equipment and support R&D initiatives; ➃ The collaboration is part of a growing trend of ecosystem companies setting up or expanding in India's semiconductor industry.

➀ The Indian Cabinet has approved Kaynes Semicon's proposal to establish a chip manufacturing facility in Gujarat. ➁ This approval is a part of India's strategy to enhance its semiconductor manufacturing capabilities and reduce dependency on imports. ➂ The move is anticipated to stimulate further investments in the semiconductor sector and generate employment opportunities in the region.

➀ Intel is reportedly considering selling its fabs, despite planning to regain industry process leadership next year. ➁ If Intel succeeds in achieving more advanced features than TSMC's processes, it will need its fabs and new ones to meet demand. ➂ This could make Intel's fabs a profitable foundry and enhance its proprietary products' performance without additional costs.

➀ Smart panelisation can significantly reduce PCB manufacturing costs by allowing multiple designs on a single panel. ➁ During prototyping, combining different PCB designs on one panel can save on both PCB and SMT costs. ➂ This approach is particularly beneficial for those new to PCB design and manufacturing, helping to avoid unnecessary expenses.

➀ Intel is considering spinning off its manufacturing division due to significant financial strains. ➁ The Intel Foundry unit, which has been losing billions, is a key part of the company's strategy but has failed to attract substantial external orders. ➂ Intel is seeking advice from investment banks Morgan Stanley and Goldman Sachs to address its financial and operational challenges.

➀ The VGMF 2024 summit in Vietnam, focusing on smart manufacturing, attracted significant industry leaders and resulted in fruitful discussions on advanced materials and processes. ➁ Key speakers from global corporations like Samsung, Intel, and Apple shared insights on investment strategies and technological advancements in Vietnam. ➂ The event facilitated numerous partnerships and agreements, highlighting Vietnam's growing role in the global manufacturing sector.

➀ Prof. Dr. Andrés Fabián Lasagni has been elected as a member of the Wissenschaftliche Gesellschaft für Lasertechnik e. V. (WLT), recognizing his contributions to laser-based manufacturing and sustainable technologies. ➁ Lasagni is dedicated to harnessing laser technology for sustainable and efficient manufacturing processes, emphasizing its potential in various applications. ➂ His research focuses on developing functionalized surfaces and optical devices using laser-based methods, with over 500 publications and 30 patents to his name.

1. EHang's EH-216 aircraft experienced a nine-fold increase in unit sales and a 920% revenue growth in Q2 2024. 2. The company's autonomous eVTOL faces minimal competition and has a growing order book and expanded manufacturing capacity. 3. A mathematical model suggests a fair value share price of $30, driven by industry-standard operating costs and continued explosive revenue growth.

➀ Notebook production is expected to grow by 3.7% in 2024, driven by entry-level and education markets. ➁ AI notebooks are anticipated in H2 but may see delayed consumer adoption due to high prices. ➂ OEMs are shifting production lines from China to Vietnam and Thailand, with Vietnam's share in notebook manufacturing expected to rise to 6% and Thailand's to 2.3% in 2024.

➀ Sunny Optical reported H1 revenue of 18.86 billion yuan, up 32.1% year-on-year; net profit increased by 147.1% to 1.079 billion yuan. ➁ The company's overall gross margin improved to 17.2%, up 2.3 percentage points from the same period last year. ➂ Mobile phone-related products contributed over 13 billion yuan in revenue, accounting for 69% of total income. ➃ The company has achieved mass production of multiple high-end camera modules and lenses. ➄ Sunny Optical is expected to become a new camera module supplier for Apple in 2025, potentially doubling revenue and profit.

➀ Continued improvement in the global semiconductor manufacturing industry; ➁ Significant growth in IC sales; ➂ Stabilizing capital expenditure and increased installed wafer fab capacity.

➀ Small fabs and packaging lines serve lower volumes, specialized technology, and prototyping. ➁ Many industries require services that big foundries and OSATs may not provide, keeping smaller manufacturers viable. ➂ Specialized processing and specialized fabs cater to unique technologies like photonics and MEMS. ➃ Packaging is experiencing more new configurations, with specialized devices co-packaging multiple chiplets and other elements. ➄ Low-volume wafer production is handled through new-product introductions and products that will never ship in high volumes.

➀ US chip factory construction lags globally, with an average time of 736 days from start to production, higher than the global average of 682 days. ➁ Major semiconductor companies like TSMC and Intel have faced significant delays in their US projects. ➂ Cultural conflicts and labor shortages are major issues affecting the efficiency and progress of factory construction in the US.