➀ SiTime has pioneered the Precision Timing market with MEMS technology; ➁ The company addresses critical challenges in timing technology with environmental stressors; ➂ SiTime focuses on AI data centers, automotive safety, IoT, and aerospace.

➀ The Fraunhofer Institute for Photonic Microsystems (IPMS) is a key player in microchip manufacturing with its comprehensive range of services from lab to fab. ➁ The institute focuses on memory technologies, sensors, actuators, and MEMS systems, with a strong emphasis on sustainable microelectronics. ➂ Fraunhofer IPMS collaborates with industry leaders and offers a full-service offering for MEMS, MOEMS, and microdisplay technologies, including pilot production and technology transfer support.

➀ The complexity of IC design due to the rise of IoT, image sensors, and 3DICs; ➁ Challenges in resistance extraction for non-Manhattan routing and unconventional shapes; ➂ The importance of accurate resistance extraction for design reliability and evolving fracturing techniques.

➀ Sensors play a crucial role in modern society across various fields such as scientific research, industrial production, national defense, and healthcare; ➁ High-end sensors are considered a 'card up the neck' technology due to their high precision and dependence on new principles, materials, and devices; ➂ The application of sensors ranges widely, from smartphones to medical instruments, and they are vital for the development of new technologies and industries; ➃ China's high-end sensor industry faces challenges such as reliance on imports and gaps in innovation and technology.

➀ Cloudview Capital leads C1 round investment in xMEMS Labs to support the commercialization of their innovative MEMS speakers and ultra-thin active cooling chips. ➁ xMEMS introduces a 1mm-thick active cooling product in August 2024, designed for high-performance smartphones and AI chips. ➂ The company's Cypress speaker, launched in late 2023, significantly enhances low-frequency sound pressure levels, marking a breakthrough in MEMS speaker technology.

➀ xMEMS Labs introduces the XMC-2400 µCooling chip, the first silicon MEMS active cooling fan for ultramobile devices and AI solutions. ➁ The XMC-2400 is a 1 mm thick, silent, vibration-free, solid-state cooling solution that can be integrated into smartphones and tablets. ➂ The chip is 96% smaller and lighter than non-silicon active coolers, with a capability to move 39 cubic centimeters of air per second under 1000 Pa back pressure.

➀ The study introduces a capillary effect-based sealing strategy to address air leakage and asynchronous vibration issues in piezoelectric MEMS speakers. ➁ This method uses PDMS liquid to autonomously seal the narrow gaps in the speaker structure, improving low-frequency and resonant frequency sound pressure levels. ➂ The sealed speakers showed a 4.9 dB increase in sound pressure level at 20 Hz and a 17.5 dB improvement around the resonant frequency, with minimal impact on other frequency performance.

➀ Bosch Sensortec introduces the world's smallest MEMS accelerometers, the BMA530 and BMA580, designed for wearables and hearables. ➁ These sensors feature a 76% smaller footprint and a height reduction, achieved through innovative WLCSP technology. ➂ The BMA580 includes innovative voice activity detection using bone conduction, enhancing power efficiency in hearable devices.

1. Nanusens has developed a MEMS digitally-tuneable capacitor for 5G and 6G RF front-ends, compatible with CMOS IC processing. 2. The capacitor features a high Q-factor, no on-state resistance, and superior reliability. 3. The technology is being targeted for antenna tuning in phones, addressing the challenges of higher frequencies and more antennas in 6G.

1. Rogue Valley Microdevices, an Oregon-based MEMS foundry, has received $6.7 million in Chips Act funding for its 300mm fab construction in Florida. 2. The company claims to be the first pure-play MEMS foundry with 300mm capability. 3. RVM offers a full-service precision MEMS foundry, specializing in MEMS and sensors manufacturing, including microfluidics and lab-on-chip platforms.

1、提出了一种基于MEMS固定梁的微波功率检测芯片，以提高性能和准确性。2、通过考虑梁的变形，利用挠曲方程建立了负载模型。3、与集总参数模型和关键力学模型相比，该模型分别提高了91.56%和43.67%的准确性。