➀ Cloudview Capital leads C1 round investment in xMEMS Labs to support the commercialization of their innovative MEMS speakers and ultra-thin active cooling chips. ➁ xMEMS introduces a 1mm-thick active cooling product in August 2024, designed for high-performance smartphones and AI chips. ➂ The company's Cypress speaker, launched in late 2023, significantly enhances low-frequency sound pressure levels, marking a breakthrough in MEMS speaker technology.

➀ xMEMS Labs introduces the XMC-2400 µCooling chip, the first silicon MEMS active cooling fan for ultramobile devices and AI solutions. ➁ The XMC-2400 is a 1 mm thick, silent, vibration-free, solid-state cooling solution that can be integrated into smartphones and tablets. ➂ The chip is 96% smaller and lighter than non-silicon active coolers, with a capability to move 39 cubic centimeters of air per second under 1000 Pa back pressure.

➀ The study introduces a capillary effect-based sealing strategy to address air leakage and asynchronous vibration issues in piezoelectric MEMS speakers. ➁ This method uses PDMS liquid to autonomously seal the narrow gaps in the speaker structure, improving low-frequency and resonant frequency sound pressure levels. ➂ The sealed speakers showed a 4.9 dB increase in sound pressure level at 20 Hz and a 17.5 dB improvement around the resonant frequency, with minimal impact on other frequency performance.

➀ Bosch Sensortec introduces the world's smallest MEMS accelerometers, the BMA530 and BMA580, designed for wearables and hearables. ➁ These sensors feature a 76% smaller footprint and a height reduction, achieved through innovative WLCSP technology. ➂ The BMA580 includes innovative voice activity detection using bone conduction, enhancing power efficiency in hearable devices.

1. Nanusens has developed a MEMS digitally-tuneable capacitor for 5G and 6G RF front-ends, compatible with CMOS IC processing. 2. The capacitor features a high Q-factor, no on-state resistance, and superior reliability. 3. The technology is being targeted for antenna tuning in phones, addressing the challenges of higher frequencies and more antennas in 6G.

1. Rogue Valley Microdevices, an Oregon-based MEMS foundry, has received $6.7 million in Chips Act funding for its 300mm fab construction in Florida. 2. The company claims to be the first pure-play MEMS foundry with 300mm capability. 3. RVM offers a full-service precision MEMS foundry, specializing in MEMS and sensors manufacturing, including microfluidics and lab-on-chip platforms.