➀ Cloudview Capital leads C1 round investment in xMEMS Labs to support the commercialization of their innovative MEMS speakers and ultra-thin active cooling chips. ➁ xMEMS introduces a 1mm-thick active cooling product in August 2024, designed for high-performance smartphones and AI chips. ➂ The company's Cypress speaker, launched in late 2023, significantly enhances low-frequency sound pressure levels, marking a breakthrough in MEMS speaker technology.