1. Tesla is expected to report its Q1 delivery numbers soon, with most analysts predicting a significant decline from the previous year's quarter. 2. Sales in Europe and China have significantly declined, potentially leading to Q1 deliveries below 300,000. 3. The autonomous driving bet is risky, with Tesla lagging behind Waymo in key metrics. 4. Tesla's energy segment is performing well, but it will take until the end of the decade to reach a 50% revenue share. 5. Forward earnings and revenue estimates vary greatly among analysts, indicating significant risk with the current stock price.
Recent #automotive news in the semiconductor industry
➀ Mazda and Rohm have signed a deal to develop GaN-based automotive power electronics.
➁ GaN can reduce power conversion losses and contribute to the miniaturisation of components through high-frequency operation.
➂ The collaboration aims to unveil a demonstration model within FY2025 and practical implementation for FY2027.
➀ Texas Instruments (TI) has launched the industry's first functionally isolated modulators designed to enhance motor control in compact robotics.
➁ These modulators improve precision and resolution, with 12 to 14 effective number of bits (ENOB) for accurate current and voltage sensing, housed in a small leadless package.
➂ Suitable for various industries including automotive, medical, and aerospace, these modulators enable more precise and reliable operations in smaller form factors.
➀ A student at the University of Applied Sciences in Hagen, Melanie Welp, has developed a contactless timing system for Paralympic swimming to prevent injury from head impacts.
➁ The prototype uses an ultrasonic sensor to measure the time at six meters and 50 centimeters before the edge of the pool.
➂ The system has been tested and shown to be possible without causing injury to swimmers.
➀ Faraday Technology Corporation, a leading provider of ASIC design services, has selected Silvaco's FlexCAN IP for advanced automotive ASIC design.
➁ The collaboration aims to enhance the capabilities of automotive systems through the use of advanced semiconductor technology.
➂ Silvaco's FlexCAN IP is designed to meet the stringent requirements of automotive applications.
➀ Power semiconductors, once a rising star with AI chips, are now facing challenges due to a slow EV market;
➁ Major players are reducing staff and delaying investments, with over 8,800 layoffs reported;
➂ The struggle is further compounded by the emerging competition from China.
➀ The European Commission announced the 'Industrial Action Plan for the European Automotive Sector' to address challenges such as international competition and software-defined vehicles (SDV).
➁ The FEDERATE project will coordinate the 'Software-Defined Vehicle of the Future Initiative' to support the plan's implementation.
➂ The Chips Joint Undertaking will fund three calls for proposals focusing on RISC-V automotive hardware, heterogeneous integration, and AI-based software engineering methods.
➀ NXP Semiconductors推出的模块化区域控制器参考设计简化了下一代电动汽车（E/E架构）的开发，支持组件评估、优化物料清单（BOM）并加快上市时间。
➁ 该设计提供系统级性能指标，包括功耗、唤醒时间、延迟和整体性能，有助于快速评估和加速市场进入。
➂ 设计基于最新的半导体创新，集成了成本效益优化的芯片组，并且硬件可根据独特需求定制，符合汽车级设计和生产质量标准。
➀ TDK has expanded its ADL3225VF series of wire-wound inductors for automotive power-over-coax (PoC) applications, supporting up to 1600 mA. These inductors are designed to simplify traditional automotive camera setups by using a single coaxial cable for both power and data transmission, reducing cabling and improving fuel efficiency.
➁ The new series reduces the mounting area by about 45% compared to the conventional ADL3225VM-2R2M while increasing the rated current by approximately 20%. This improvement is achieved through proprietary materials and structural design enhancements.
➂ Key features include compatibility with high currents, ensuring high impedance over a wide frequency range, and suitability for high-temperature environments, with an operating range of -55°C to +155°C.
➀ The article discusses a reference design for drone electronic speed controllers (ESCs), focusing on the STEVAL-ESC001V1 by ST Microelectronics, designed specifically for entry-level commercial drones.
➁ The design supports three-phase brushless (BLDC) and permanent magnet synchronous motors (PMSM), with a peak current handling capacity of up to 30A, powered by 6S LiPo batteries or similar DC sources.
➂ Key features include an advanced sensorless field-oriented control (FOC) algorithm, support for motor parameter optimization via the ST Motor Profiler, and integrated safety features like overcurrent and overvoltage protection, making it suitable for small UAVs and RC vehicles.
➀ Littelfuse has launched the AEC-Q200-qualified 823A Series Fuse, a high-voltage surface-mount device designed for modern automotive applications. It offers reliable overcurrent protection, a compact 5 x 20 mm footprint, and is suitable for high-voltage systems up to 1000 Vdc.
➁ Key features include a wide operating temperature range (-40°C to 125°C), prevention of unintended fuse openings due to inrush and surge currents, and support for efficient PCB layouts.
➂ The 823A Series is ideal for automotive and industrial applications such as Battery Management Systems (BMS), Battery Disconnect Units (BDU), and high-voltage DC-DC converters.
➀ A trawler caught 7 1/2 times as much fish as with conventional driftnet methods using new electronic fish-finding equipment developed by Kelvin and Hughes (Marine) limited;
➁ The story dates back to 65 years ago, when CERES (Combined Echo Ranging Echo Sounding) equipment was introduced;
➂ CERES combined echo-ranging and echo-sounding to improve fishing efficiency.
➀ Cadence successfully demonstrates first-pass silicon success of its UCIe™ standard package IP on Samsung Foundry's 5nm automotive process;
➁ This milestone highlights Cadence's commitment to high-performance, automotive-grade IP solutions;
➂ The solution meets the stringent requirements of next-generation automotive and high-performance computing applications.
➀ Microchip Technology has introduced the AVR SD family of microcontrollers designed to help engineers meet strict safety standards while reducing design costs and complexity.
➁ These MCUs include built-in functional safety features, making them suitable for applications requiring high safety assurance, such as those needing ASIL C and SIL 2 compliance.
➂ The MCUs come with a TÜV Rheinland-certified safety management system and various hardware safety features, including dual-core lockstep CPU and error correction code, aiding in efficient development and reliability.
➀ MICROTEST has introduced the VIP ULTRA tester, the latest addition to its VIP Extended product line, designed specifically for testing Wide Band Gap (WBG) devices made from Silicon Carbide (SiC) and Gallium Nitride (GaN).
➁ The VIP ULTRA supports multiple configurations with voltage capabilities of 1.7kV or 4kV and current capacities up to 250A, offering high parallelism for testing high-power chips.
➂ This advanced tester is particularly effective for testing high-power chips at the silicon wafer level, ensuring functionality before chip dicing and integration, driven by increasing demands in automotive and industrial sectors.
➀ Ed向他的日记透露，执政不到一年的工党政府正在削减福利预算；
➁ 总理认为Ed是一个多面手，经常找他解决问题，Ed成了他的跑腿；
➂ 总理希望Ed帮助解决长期病假人员的问题，以减少福利预算开支，并避免政府形象受损。
1. Carvana's stock has dropped over 40% from its February peaks, presenting a buying opportunity at a reasonable ~22x adjusted EBITDA multiple; 2. The company's Q4 results showed strong retail unit sales and healthy adjusted EBITDA margin expansion; 3. Management expects sequential growth in retail unit sales in Q1 and FY25 despite a tough macroeconomy.
➀ Softbank has acquired Ampere, an Arm-based server chip designer, for $6.5 billion.
➁ Ampere's technology originates from the Arm-based server processors of Applied Micro Circuit Corp (AMCC), which was acquired by MACOM in 2016.
➂ Softbank's acquisition of Ampere aligns with its mission to build AI chips and its recent purchase of Graphcore to enhance IC design expertise.
➀ Nexperia has introduced industry-leading 1200 V silicon carbide (SiC) MOSFETs with top-side cooling, designed for high-power applications such as EV charging stations, BESS, and photovoltaic inverters.
➁ These MOSFETs feature enhanced thermal performance, low inductance, and improved power density due to the innovative X.PAK package that combines SMD and through-hole cooling benefits.
➂ The devices maintain stable performance across a wide temperature range (25°C to 175°C), offering better thermal management and reliability compared to conventional options.
➀ Texas Instruments (TI) has released new power-management chips aimed at meeting the rising power demands of modern data centers, particularly for high-performance computing and AI applications.
➁ These chips, including the TPS1685 and integrated GaN power stages, offer enhanced protection, higher density, and improved efficiency, with a focus on reducing size by 50% compared to traditional hot-swap controllers.
➂ TI's innovations are designed to support data center engineers, power system architects, and hardware developers in creating more sustainable and energy-efficient data center infrastructures.