➀ Qualcomm is reportedly testing the next-gen Snapdragon X2 Elite SoC with 18 Oryon V3 CPU cores and up to 64GB RAM, a 50% increase from its predecessor;
➁ The chip aims to compete with AMD and Intel's AI-enhanced laptop processors, with rumors suggesting potential desktop/server market expansion using advanced cooling solutions;
➂ Official announcements are expected at Snapdragon Summit 2025 in September, alongside new Windows-on-Arm device designs from partners.
➀ TSMC has proposed a joint venture with US chip designers like NVIDIA and AMD to operate Intel's semiconductor fabs, with TSMC holding no more than a 50% stake.
➁ The talks are in early stages, following President Trump's push to revitalize the US semiconductor industry.
➂ TSMC would run the operations of Intel Foundry, but wouldn't own more than 50%.
➀ Apple's iPhone 16e features its first in-house 5G modem, the C1 modem, while the C2 is in testing.
➁ The C3 modem is set for a 2027 release, coinciding with the end of Apple's Qualcomm licensing agreement.
➂ Apple has been working on in-house 5G modems and will launch the next-gen C3 modem in 2027.
➀ Samsung announced the Galaxy S25 series, including the S25, S25+, and S25 Ultra.
➁ The S25 and S25+ feature Snapdragon 8 Elite processors, 12GB RAM, and One UI 7 on Android 15.
➂ The S25 Ultra boasts a 6.9-inch anti-reflective display, 200MP camera, 16GB RAM, and up to 1TB storage.
➀ Samsung Galaxy Unpacked 2025 will introduce the Galaxy S25 Ultra, S25, S25+, and tease the Galaxy S25 Slim.
➁ The event may also reveal new AR glasses or an XR headset.
➂ Samsung will use Qualcomm Snapdragon 8 Elite and Micron LPDDR5 memory in the S25 series, excluding its own components.
➀ Lantronix has launched the Open-Q 8550CS System-on-Module (SOM), built on the Qualcomm Dragonwing QCS8550 processor, offering low-power on-device AI and ML capabilities.
➁ The SOM is designed for demanding AI/ML applications in extreme Edge computing environments, supporting advanced video processing, AI inference, and Edge AI gateway integration.
➂ Key features include low power consumption with a 4nm process, dual eNPU for AI acceleration, and support for high-speed connectivity and multiple display interfaces.
