➀ The article introduces a reference design for e-scooter traction motor control by Microchip, focusing on its dual-board, scalable design for quick prototyping. ➁ It supports hub and mid-drive systems, multiple motor types, and safety features for efficient development. ➂ The design is compatible with 48V batteries and up to 6kW motors, aiming to accelerate e-scooter development.

➀ Researchers at Princeton Engineering and the Indian Institute of Technology have used AI to reduce the time and cost of creating new wireless chips; ➁ AI generates complex microchip electromagnetic structures and circuits; ➂ The AI approach can result in unusual but practical designs.

➀ QuickLogic has been awarded a $6.575 million contract; ➁ The contract supports the development of Strategic Radiation Hard (SRH) high reliability FPGA technology; ➂ The technology aims to meet US Department of Defense (DoD) requirements.

➀ The design is optimized to extract maximum power from solar panels under various conditions; ➁ It supports various panels, chemistries, and power ranges for outdoor applications; ➂ The design includes features like battery and output load current/voltage/power metering, temperature monitoring, and automatic cooling fan control.

➀ The article commemorates the passing of Gordon Mah Ung, a respected technology journalist; ➁ The author reflects on the impact Gordon had on the technology industry and the personal regret of not expressing gratitude; ➂ The author mentions the importance of expressing gratitude and the family's philanthropic focus on pancreatic cancer research.

➀ Compute Express Link (CXL) technology is expected to move from a niche to mainstream use in 2025; ➁ CXL's support for memory expansion is a significant driver, with various server and memory solutions now available; ➂ CXL 2.0 and future generations of PCIe/CXL will enable more advanced use cases like switching and dynamic memory allocation.

➀ Crypto Quantique has upgraded its QuarkLink IoT platform with a hybrid post-quantum cryptographic algorithm; ➁ The platform reduces the time and expense of implementing security functions in embedded devices by up to 10X; ➂ The hybrid key encapsulation mechanism combines X25519 with Kyber (ML-KEM) for both current and future security.

➀ Scientists and engineers from UKAEA and the University of Bristol have created the world's first carbon-14 diamond battery; ➁ The battery leverages the radioactive isotope carbon-14 to produce a diamond battery with a potential lifespan of thousands of years; ➂ The technology could be used in medical devices and extreme environments, providing continuous power for decades.

➀ Researchers from City University of Hong Kong have observed a new vortex electric field with potential applications in enhancing future electronic, magnetic, and optical devices; ➁ The research, published in Science, could lead to improved memory stability and computing speed, as well as impact quantum computing, spintronics, and nanotechnology fields; ➂ The team developed an innovative ice-assisted transfer technique to create twisted bilayers with a wide range of twist angles, leading to the discovery of a 2D quasicrystal that may enhance various device capabilities.

➀ Asahi Kasei Microdevices (AKM) has launched the HQ0A11 InAs Hall element, which is its smallest and thinnest package yet at 0.8 x 0.4 x 0.23 mm. It is 85% smaller than the previous model, HQ0811, and offers a 16% better S/N ratio. This advancement is expected to improve performance in smartphone camera modules and small robots. ➁ The HQ0A11 features a GaAs Hall element with over 3.5 times higher position detection accuracy than its predecessor, the HG0C11. ➂ The element's compact size and high sensitivity make it suitable for applications requiring precise position detection, such as camera lens control.

➀ Microchip is shutting down a factory in Arizona due to high inventory levels and ample capacity; ➁ The closure is expected to be completed in Q3 2025, resulting in the loss of 500 jobs; ➂ The company anticipates annual savings of $90 million from the closure, following a challenging few quarters in the automotive sector.

➀ Melexis introduces a family of angle-sensing absolute magnetic encoder ICs for electric motors that operate at high speeds and offer 1° accuracy or better. ➁ The MLX90382 can track absolute angle position and speeds up to 200,000rpm by detecting the three components of magnetic flux density. ➂ The ICs come in various versions and packages, and offer on-axis and off-axis sensing capabilities.

➀ An introduction to sensor interfacing, its importance, and basic principles; ➁ Types of sensors and signal conditioning techniques; ➂ Interfacing sensors with microcontrollers and handling noise and signal interference.

➀ This reference design introduces a compact BLDC motor controller optimized for high performance and efficiency in micro-mobility applications. ➁ The controller, designed by Microchip, supports up to 3kW power levels and features advanced control algorithms for precise torque and speed control. ➂ The design includes a robust three-phase inverter stage and various safety protections, making it suitable for e-scooters and e-bikes.

➀ Tanaka claims to have developed the world's first bulk platinum with controlled crystal grain size in the nano scale; ➁ This new technology enables the development of pure platinum with 99.9% or higher purity, offering 10 times the hardness and 4 times the strength of typical platinum materials; ➂ The developed platinum has unique properties due to its high density of small-angle grain boundaries, large-angle grain boundaries, dislocations, and other lattice defects, which may lead to its application in various industries.

➀ Hynix plans to start sampling HBM3e 16hi memory with 48 GB capacity per cube in H1 2025; ➁ HBM3e 16hi offers a high-capacity alternative before the production of HBM4 16hi; ➂ HBM3e 16hi can deliver a maximum capacity of 384 GB per system, surpassing NVIDIA’s Rubin at 288 GB; ➃ Transitioning from HBM3e to HBM4 will double the I/O count and increase die size, but the per-die capacity remains at 24 GB; ➄ HBM3e 16hi will adopt the Advanced MR-MUF stacking process for higher stack counts and computational bandwidth.

➀ The University of Siegen will host two major international conferences, CARV and MCPC 2025, focusing on future industrial challenges such as handling global disruptions in production and supply chains and developing intelligent systems for customized product manufacturing. ➁ The conferences will take place from September 9 to 12, 2025, with experts from around the world expected to discuss current developments and future challenges under the theme 'New Paradigms for Anticipated Uncertainty'. ➂ The two conferences, CARV and MCPC, will address complementary topics: CARV on agile and reconfigurable production systems and sustainable manufacturing processes, and MCPC on the use of digital technologies and product personalization through individual mass production.