➀ Element Six, a specialist in synthetic diamond materials, has launched Cu-Diamond, a copper-plated diamond composite material with high thermal and electrical conductivity.

➁ Designed to address thermal management challenges in advanced semiconductor devices, Cu-Diamond enables greater performance and reliability for applications like AI, HPC, and GaN RF devices.

➂ The new material offers thermal conductivity in the 800 W/mK range, optimized for high-demand applications, and can be manufactured in complex shapes for seamless integration into advanced packaging configurations.

➀ Montech's Heritage Pro case combines leather, glass, and steel in a unique design reminiscent of a designer handbag.

➁ The case supports full-size ATX power supplies, large graphics cards, and rear-connector motherboards, making it suitable for high-end builds.

➂ Despite its premium feel, the case lacks some thoughtful design elements such as easy-to-clean dust filters and RGB fans.

➀ This edition of PowerBites features new technologies aimed at making power devices smaller, faster, and cooler.

➁ The article highlights advancements in semiconductor technology that contribute to these improvements.

➂ Various power products are also introduced in this edition.