<p>Thermic Edge Ltd proudly introduces its new Atomic Layer Deposition (ALD) System, designed to accelerate the integration of 2D materials into next-generation semiconductor devices. The system combines single-chamber ALD and high-temperature annealing, reducing contamination risks and improving process efficiency. It supports wafer-scale processing up to 8 inches and ensures uniform deposition across large-area substrates. The system features a showerhead gas delivery system for uniform gas distribution, precise temperature control, and multi-gas compatibility for oxide, sulfide, and nitride processing.</p>