1. TSMC's 3nm process faces yield challenges, causing production delays for Apple's M4 and A18 chips; 2. Current yields are reportedly around 55-65%, lower than expected, leading to reduced orders from Apple; 3. TSMC is optimizing processes to improve yields, but technical hurdles remain, potentially affecting Apple's product roadmap and TSMC's competitiveness.

1. TSMC's 3nm process capacity is fully booked by Apple and Intel, driving a surge in demand for advanced semiconductor manufacturing; 2. The competition for cutting-edge chip technology has intensified, with Apple securing TSMC's initial 3nm production for iPhones and Macs; 3. The increased orders are boosting backend supply chains, including packaging and testing services, amid global semiconductor shortages.

1. TSMC's 3nm process capacity utilization is expected to exceed 80% in Q2 2024, driven by strong demand; 2. Apple's upcoming M4 chip series will adopt TSMC's enhanced 3nm N3E process, boosting production scale; 3. Intel's delayed 18A process gives TSMC a competitive edge in advanced semiconductor manufacturing.

1. TSMC's Arizona 3nm fab project faces delays due to labor shortages and regulatory hurdles; 2. Rising costs from inflation, supply chain disruptions, and technology migration challenges strain budgets; 3. Intensifying competition with Intel and Samsung in advanced node manufacturing complicates TSMC's global expansion strategy.

1. TSMC's 3nm process capacity is fully booked by Apple and Intel, leading to increased orders and revenue; 2. The competition between Apple and Intel for advanced chip technology intensifies industry rivalry; 3. TSMC's dominant position in semiconductor manufacturing is reinforced, impacting global supply chains and market dynamics.

➀ Apple's next-gen iPhone 17 Air rumored to feature an A17 chip; ➁ 8GB of RAM for Apple Intelligence; ➂ Single 48MP rear camera; ➃ TSMC's 3nm process node.

1. Intel has announced that its 3nm process is in high volume production at Leixlip, producing Xeon 6 processors and foundry wafers for customers. 2. The process offers up to 18% better performance at the same power, a flexible set of metal interconnect options, and up to 10% greater density than Intel 4. 3. Variants of Intel 3 include Intel 3-T, Intel 3-E, and Intel 3-PT, each tailored for specific applications such as 3D-stacking, external interfaces, and enhanced performance respectively.