<p>➀ TSMC showcased its advanced semiconductor technologies at the 2025 Europe Symposium, highlighting N3 nodes' high-volume production with variants for CPUs, cost-effective products, and automotive applications; </p><p>➁ Unveiled next-gen N2 and A16/A14 processes with performance/efficiency improvements, and introduced CFET transistor designs achieving double density; </p><p>➂ Demonstrated 3D Fabric innovations (SoIC/CoWoS), wafer-scale AI systems (SoW-X), and specialized automotive/IoT solutions including RRAM/MRAM and N4C RF for emerging wireless standards.</p>
Related Articles
- ML and Multiphysics Corral 3D and HBM9 months ago
- Broadcom unveils gigantic 3.5D XDSiP platform for AI XPUs — 6000mm² of stacked silicon with 12 HBM modules9 months ago
- [News] Google Reportedly Adopts TSMC’s N3P Process instead of 2nm for Tensor G610 months ago
- Prototype of a Particularly Sustainable and Energy-Autonomous E-Bike Terminal Developed at HKA5 months ago
- Enhancing Chitosan Films with Silanized Hexagonal Boron Nitride for Sustainable Applications5 months ago
- White Knight to save Shibaura5 months ago
- Ed Rides The Tariff Roller-Coaster5 months ago
- Image Acquisition Software Launch for Centralized Control of NanoZoomer® MD Series5 months ago
- Trump creates U.S. Investment Accelerator to manage CHIPS Act and 'negotiate much better deals'5 months ago
- Water Purification and Energy Generation Using a CNF@CTAB-MXene/PTFE Janus Membrane5 months ago