Recent #Supply Chain news in the semiconductor industry
➀ TSMC stopped supplying chips to SOPHGO, a Chinese tech company, amidst an investigation by the US商务部;
➁ SOPHGO released a statement denying the reports and providing evidence of its innocence;
➂ SOPHGO is a RISC-V and TPU processor developer with a strong R&D team and ties to Bitmain.
➀ Huawei Mate70 is rumored to feature a side capacitive fingerprint button instead of under-screen fingerprint technology;
➁ The change is expected to impact suppliers like Goodix Technology and OFILM, which supply fingerprint modules;
➂ The Kirin chip for Mate70 is said to be close to 7nm performance and includes features for eye tracking and gesture recognition;
➃ The new phone's cost is estimated to be about 30% higher than Apple's iPhone, but with a lower price tag;
➄ Suppliers such as BOE and TCL Huaxing are likely to supply displays, while Xinwangda is expected to provide batteries;
➅ The phone may go on sale as early as the end of this month.
➀ The increase in HBM production in 2025 is expected to be limited, leading to a tighter supply.
➁ The reasons include adjustments in HBM production capacity, customization trends with a 40% die size penalty, and low yield of HBM3E 12hi and HBM4 from Samsung and Micron.
➂ The supply-demand ratio is expected to tighten further to -5% compared to the previous -1%, with SK Hynix expected to be a major beneficiary.