➀ TriEye introduces the TES200 1.3MP SWIR Image Sensor, designed for machine vision and robotics systems with superior resolution and efficiency; ➁ The sensor leverages CMOS-based technology, offering a cost-effective alternative to traditional InGaAs technology; ➂ It is set to address needs in industries like automotive, biometrics, and AI applications.

➀ eYs3D Microelectronics introduces SenseLink, a multi-camera sensing system chip that enhances AI by merging sensor data. ➁ The technology benefits smart homes, industrial automation, medical devices, and automotive industries. ➂ SenseLink supports up to seven cameras and includes three image signal processors, making it versatile for various applications.

➀ Hikrobot introduced the Forklift Latent Mobile Robot QF-1000 and Tugging AMR in India, showcasing advancements in machine vision and mobile robotics. ➁ The QF-1000 features a versatile chassis, enhanced maneuverability, and 360° safety protection. ➂ The Tugging AMR offers high load capacity, precision movement, and automatic hooking/unhooking capabilities.