Recent #Failure Analysis news in the semiconductor industry

7 months ago

➀ Intel's decision to integrate DRAM into the CPU packaging for Lunar Lake (LNL) was driven by competition with Apple Silicon and a response to Microsoft's Surface adopting ARM processors.

➁ Three key decisions were made for LNL: integrating DRAM, specifying exclusive component suppliers, and increasing NPU computing power to 48 TOPS.

➂ The failure of LNL was attributed to the low willingness of brands and manufacturers to adopt the parts due to reduced flexibility, Intel's lower bargaining power with DRAM suppliers, and the immature AI PC market.

Failure AnalysisIntelLunar Lake
9 months ago
➀ 52.7% of failures in 200G FR4 modules are due to 50G PAM4 DFB laser power degradation or absence. ➁ PCBA failures significantly increased to 24.8%, likely due to high-speed HDI board and dense soldering processes. ➂ 15.9% of failures are attributed to gold wire bonding in the Rx section. ➃ In 400G FR4 modules, EML is used instead of DFB, resulting in lower failure rates at 13.4%, with PCBA emerging as the primary failure point.
Failure AnalysisMetaOptical Modules