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December 23
- BE Semiconductor Set to Profit from iPhone 18 Pro's Variable Aperture, Apple's High-End M5 Chips, and CPO Technology
➀ BESI's stock price drop in 3Q24 reflects 2H24 shipment delays already priced in;
➁ iPhone 18 Pro series to upgrade to variable aperture in 2026, with BESI supplying assembly equipment for aperture blades;
➂ M5 series chips for Apple PCC and Macs to use TSMC's advanced N3P node, with mass production expected in 2025-2026;
➃ TSMC's SoIC shipments projected for significant growth starting in 2025-2026, with AMD, AWS, and Qualcomm as key customers;
➄ Hynix to adopt hybrid bonding for HBM4e in 2026, offering higher packaging density and better performance;
➅ Nvidia's Quantum InfiniBand switch to adopt CPO in 2025, driving demand for hybrid bonding.
November 5
- Exclusive Deep Dive into the Failure of Intel Lunar Lake - Ming-Chi Kuo
➀ Intel's decision to integrate DRAM into the CPU packaging for Lunar Lake (LNL) was driven by competition with Apple Silicon and a response to Microsoft's Surface adopting ARM processors.
➁ Three key decisions were made for LNL: integrating DRAM, specifying exclusive component suppliers, and increasing NPU computing power to 48 TOPS.
➂ The failure of LNL was attributed to the low willingness of brands and manufacturers to adopt the parts due to reduced flexibility, Intel's lower bargaining power with DRAM suppliers, and the immature AI PC market.