➀ Shuttle introduces the ultra-compact XH610G2 mini-PC; ➁ The mini-PC supports dual-slot GPUs and Intel's latest CPUs; ➂ The system includes a strict TDP limit and lacks eGPU support.

➀ Intel's Arrow Lake CPUs have sold poorly in Germany; ➁ Core Ultra 200S sales have stagnated after only one week; ➂ AMD's market share in CPUs has increased to 95% on Mindfactory.

➀ AMD's Ryzen 7 9800X3D is listed by retailers ahead of its official announcement; ➁ The rumored 3D V-cache model is expected to be priced around $500; ➂ AMD's holiday promotion may affect the pricing.

➀ AMD is reportedly preparing new Ryzen 5 5600T and 5600XT CPUs for the AM4 platform; ➁ The new CPUs are expected to have six cores and twelve threads; ➂ The Ryzen 5 5600XT is rumored to have a higher base clock than the 5600T.

➀ Intel CEO Pat Gelsinger showcased the upcoming Panther Lake CPU with Xe3 GPU at Lenovo's 2024 Tech World event; ➁ Panther Lake will be the first to use Intel's 18A manufacturing process with RibbonFET gate-all-around FETs and PowerVia backside power delivery technology; ➂ The CPU will feature new P-cores and E-cores, and is expected to introduce Intel's Xe3 graphics architecture.

➀ Intel has launched its Core Ultra 200S series processors, known as Arrow Lake, for the desktop platform. The initial launch includes five CPU SKUs, but a support document suggests a potential sixth SKU, the Core Ultra 9 295K, might exist. ➁ The document lists the Core Ultra 9 295K as a CPU without a bundled cooler, which is unusual for Intel. ➂ Speculations include it being a typo or a successor to the Core i9-14900KS with a higher clock speed.

➀ NPUs are hardware accelerators for artificial intelligence, complementing CPUs and GPUs. ➁ NPUs are designed for repetitive tasks with high-throughput and parallelism, such as neural networks and machine learning. ➂ NPUs are integrated into consumer devices like laptops and PCs, and are also used in cloud-based systems for edge intelligence and reduced latency.

➀ MSI confirms CUDIMMs are compatible with AMD Ryzen 8000 and 9000 processors; ➁ X870 motherboards optimized for ultra-fast memory modules; ➂ Ryzen 7000 series CPUs incompatible due to unresolved booting issue

➀ AMD has concealed Taiwan branding on Ryzen CPU packaging ahead of China market launch; ➁ The company has used a black sticker to erase origin information; ➂ This follows a history of China's prohibition on mentioning Taiwan on product packaging.

➀ AMD and Supermicro have demonstrated their ability to act like smaller entities when solving unique computer problems for customers. ➁ They have collaborated with studios to ship systems without CPUs, allowing customers to determine the best CPUs for their needs. ➂ This collaborative approach has led to more business for both companies, showing that being collaborative can ironically lead to more sales.

1. ASUS and MSI have released BIOS updates based on Intel's new 0x129 microcode to address stability issues affecting 14th and 13th Gen CPUs. 2. The updates are available for various motherboard models, including ASUS's Z790 chipset-based models and MSI's MEG and MPG series. 3. Intel has extended the warranty by two years for affected CPUs, urging users to update their BIOS to prevent potential permanent damage.

1. Intel is facing a potential class-action lawsuit due to stability issues with its 14th and 13th Gen Core processors. 2. The law firm Abington Cole + Ellery is investigating the situation and inviting affected CPU owners to participate. 3. The primary cause of the instability has been identified as elevated operating voltages, which Intel plans to address through a microcode update.

1. AMD announced a short delay for its Ryzen 9000 series processors based on Zen 5 due to a packaging issue. 2. The delay may be caused by a typo on the heatspreader and retail box of one SKU, mistaking a Ryzen 7 9700X for a Ryzen 9. 3. AMD plans to release the Ryzen 7 9700X and Ryzen 5 9600X on August 8th, and the Ryzen 9 9950X and Ryzen 9 9900X on August 15th.

1、Intel CEO Pat Gelsinger 在 Computex 2024 上展示了 Intel 的客户端路线图，包括 Panther Lake 平台。 2、Panther Lake 预计在 2025 年推出，使用 Intel 18A 节点。 3、Intel 将在下周启动 Panther Lake 的首个 18A 晶圆。

1、英特尔推出Lunar Lake架构，包括新P核心Lion Cove和E核心Skymont。 2、该架构使用TSMC N3E和N6工艺制造。 3、Lunar Lake 集成了新的NPU 4，性能高达48 TOPS。 4、该架构也包括新的Xe2-LPG显卡和Thunderbolt 4、Wi-Fi 7连接。 5、Lunar Lake预计将于2024年第三季度推出。

1、英特尔CEO帕特·盖尔辛格今日晚些时候将在Computex 2024上发表主题演讲，主题为“AI无处不在地”。 2、演讲中将涵盖AI PCs、Xeon 6处理器、Gaudi AI加速器和Intel的OpenVINO软件生态系统等四个主要主题。 3、英特尔还将推出新的移动PC SoC，称为Lunar Lake，具有显着的能源效率提高和新的架构。

1、AMD 宣布将推出 Ryzen 5000XT 系列 CPU，包括 Ryzen 9 5900XT 和 Ryzen 7 5800XT。 2、这两个芯片将于 7 月推出，支持 AM4 平台。 3、Ryzen 9 5900XT 是 16 核心 Zen 3 芯片，Ryzen 7 5800XT 是 8 核心 Zen 3 芯片。

1、AMD 发布 Ryzen AI 300 系列移动处理器，基于 Zen 5 架构、RDNA 3.5 集成显卡和 XDNA2 NPU。 2、Ryzen AI 9 HX 370 和 Ryzen AI 9 365 两款处理器，最大频率分别为 5.1 GHz 和 5.0 GHz。 3、该系列处理器适用于高性能笔记本电脑，支持 AI inferencing 和 Generative AI 性能。

1、AMD CEO Dr. Lisa Su 将在 COMPUTEX 2024 上发表题为「AI Era 中的高性能计算未来」的演讲。 2、预计将宣布新的 Zen 5 CPU 架构和基于其的芯片。 3、还将涉及服务器 CPU 和 GPU/加速器产品线。

1、 COMPUTEX 2024即将开始，所有PC行业巨头都将集聚台北。 2、 NVIDIA、AMD、Intel和Qualcomm等四大芯片厂商将在展会上发布新的产品和技术。 3、 预计将有多个新产品和技术发布，包括新的CPU、GPU和AI加速器等。