➀ Intel CEO Pat Gelsinger is leaving after three years; ➁ The U.S. imposes trade restrictions on 140 Chinese companies involved in technology trade; ➂ Anduril Industries wins a contract to modernize the U.S. Space Surveillance Network (SSN); ➃ BAE Systems plans to recruit over 2,400 staff in the UK; ➄ Microchip announces the closure of its Arizona wafer fabrication facility.

➀ BAE Systems is recruiting for 2,400 jobs across the UK; ➁ Pat Gelsinger, CEO of Intel, is leaving the company; ➃ A space startup is delivering cargo to precise locations on Earth.

1. BAE Systems and GlobalFoundries collaborate on secure chip fabrication for aerospace and defense. 2. Europe launches a pilot line for 10nm and 7nm FD-SOI ICs. 3. SiFive introduces its 4th generation RISC-V CPU cores. 4. A startup, Etched, develops AI chips faster than Nvidia's Blackwell. 5. The automotive semiconductor market shows signs of slowing down.

1. The global radiation-hardened chips market is projected to grow from $1,278.0 million in 2023 to $3,283.8 million by 2033, with a CAGR of 9.90%. 2. Key players driving market growth include BAE Systems, Honeywell International, Advanced Micro Devices, Microchip Technology, and Texas Instruments. 3. The report provides a detailed analysis of market trends, applications, products, and regional dynamics over the next decade.