<p>➀ Fraunhofer IZM-ASSID celebrated 15 years as a pioneer in 3D system integration and wafer-level packaging, driving innovations like TSV processing and chiplet architectures;</p><p>➁ Flagship projects CEASAX (300mm microelectronics R&D) and APECS (EU Chips Act pilot line) strengthen Europe's competitiveness in semiconductor advanced packaging and edge AI;</p><p>➂ Strategic collaborations with GlobalFoundries, Infineon, Siemens, and academia solidify its role in global high-tech ecosystems and technological resilience.</p>