<p>➀ The PUNCH project, led by Fraunhofer IZM and IMEC, develops photonic integrated circuits (PICs) to enable ultra-fast, low-latency data transmission, targeting applications in data centers and traffic networks;</p><p>➀ PICs combine optical signaling with electronic chips using Fan-Out Wafer Level Packaging, boosting network speeds from 200 Gb/s to 1.6 Tb/s while reducing energy consumption and costs;</p><p>➂ Supported by EU Horizon Europe funding, the project involves collaborations with NVIDIA, Ericsson, and the University of Cambridge and aims to finalize a scalable solution by 2026.</p>