➀ Jinghe Integration and SmartSens-W jointly developed the industry's first 180 million pixel full-frame CIS chip using lithography splicing technology. ➁ The new chip features 1.8 billion ultra-high pixels and supports 8K 30 fps with HDR capabilities. ➂ This breakthrough challenges the long-standing dominance of Japanese Sony in the high-pixel full-frame CIS market. ➃ The success of this chip marks a significant advancement for Chinese semiconductor technology in the global market.