<p>➀ Winbond is developing 3D NAND and 3D NOR product lines as planned.</p><p>➁ The 3D NOR product will be introduced to customers at the Munich Electronics Show in November.</p><p>➂ The company plans to expand mass production of 3D NOR in the next year.</p><p>➃ The 192-layer 3D NAND is scheduled to enter mass production next year.</p><p>➄ The company's 3D Nor flash has completed chip testing last year.</p><p>➅ The product has a 20% market share in NOR Flash and uses exclusively developed 3D stacking technology.</p><p>➆ The company aims at high-margin markets such as automotive and industrial control.</p><p>➇ Another 3D NAND flash product is in the final stage of process adjustment and will be shipped for use in Nintendo game discs.</p><p>➈ It is expected to contribute to revenue in the second half of next year.</p>