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December 4
- VSMC Celebrates Breaking Ground on 300mm Fab in Singapore1. VSMC, a joint venture between Vanguard International Semiconductor Corporation and NXP Semiconductors, celebrated the groundbreaking of its new 300mm wafer manufacturing facility in Singapore. 2. The facility is expected to start production in 2027 and reach an output of 55,000 300mm wafers per month by 2029. 3. The new fab will support NXP's growth plans and contribute to the development of the semiconductor industry.
December 3
- Applied Materials Issues Statement on Latest U.S. Export Regulations1. Applied Materials issued a statement regarding the updated export regulations for semiconductor technology announced by the U.S. government. 2. The company confirmed that it is not changing its business outlook for the first quarter of fiscal 2025 due to the new regulations. 3. The statement includes forward-looking statements about the potential impact of the regulations on the company's operations and financial outlook.
November 26
- Tower Semiconductor Releases 300mm Silicon Photonics Process as a Standard Foundry Offering1. Tower Semiconductor announced the release of its new 300mm Silicon Photonics (SiPho) process as a standard foundry offering. 2. The process complements Tower's existing 200mm platform and is tailored to meet the needs of high-speed data communications for next-generation datacom applications. 3. The 300mm offering features advanced silicon waveguides and low-loss silicon nitride waveguides, enhancing compatibility with industry-standard OSAT platforms.
November 19
- Tower Semiconductor Begins Production of 1.6Tbps Optical Transceivers on its Latest Silicon Photonics Platform1. Tower Semiconductor has begun volume production of 1.6Tbps silicon photonic products based on its latest platform. 2. The platform doubles data rates compared to current 800Gbps products. 3. The process supports 200Gbps per lane, achieving a total of 1.6Tbps transceiver throughput.
- Applied Materials Announces New Collaboration Model for Advanced Packaging at Summit on Energy-Efficient Computing1. Applied Materials announced a new collaboration model for advanced packaging to accelerate the commercialization of advanced chip packaging technologies. 2. The company convened top R&D leaders from the semiconductor industry to encourage alliances between equipment makers, material providers, device companies, and research institutes. 3. The goal is to fast-track new technologies for the next generation of energy-efficient computing.
November 15
- Applied Materials Announces Fourth Quarter and Fiscal Year 2024 Results1. Applied Materials reported record revenue of $7.05 billion for the fourth quarter and $27.18 billion for the full year, with revenue up 5% and 2% year over year, respectively. 2. GAAP EPS was $2.09 and non-GAAP EPS was $2.32 for the fourth quarter, down 12% and up 9% year over year, respectively. 3. Annual GAAP EPS was $8.61 and non-GAAP EPS was $8.65, up 6% and 7% year over year, respectively.
November 13
- Tower Semiconductor Reports 2024 Third Quarter Financial Results1. Tower Semiconductor reported a 6% QoQ revenue growth in Q3 2024, reaching $371 million. 2. The company announced a $350 million investment plan to expand SiPho and SiGe capacity. 3. Tower Semiconductor expects Q4 2024 revenue to be $387 million with a 5% growth range.
November 12
- NXP’s New i.MX 94 Family of Applications Processors Delivers Safe, Secure Connectivity for the Industrial and Automotive Edge1. NXP introduces the i.MX 94 family, a new addition to its i.MX 9 series of application processors, designed for industrial control, PLCs, telematics, and automotive gateways. 2. The i.MX 94 family integrates real-time processing with industrial networking protocols, supports post-quantum cryptography, and features an integrated NPU for AI and machine learning capabilities. 3. The family offers scalable system-level design support and integrates with NXP's wide range of wireless solutions.
- Allegro MicroSystems Introduces Advanced Magnetic and Inductive Position Sensing Solutions at Electronica 20241. Allegro MicroSystems introduces new inductive position sensors and micropower magnetic switches and latches at Electronica 2024; 2. These solutions enhance accuracy, efficiency, and reliability while reducing power consumption by up to 50%; 3. The new sensors and switches are suitable for various applications in automotive, industrial, and consumer markets.
- NXP Announces Industry-First Ultra-Wideband Wireless Battery Management System Solution1. NXP has introduced the industry's first wireless battery management system (BMS) solution with Ultra-Wideband (UWB) capabilities. 2. The solution simplifies EV assembly, enhances battery energy density, and accelerates time to market. 3. It uses UWB technology for robust and reliable data transfer within the battery pack.
October 31
- Allegro MicroSystems Reports Second Quarter 2025 Results1. Sales increased 12% sequentially to $187 million; 2. Sequential growth in Automotive and Industrial & Other end markets; 3. Non-GAAP EPS at $0.08, at the high end of outlook.
October 23
- NXP’s Advanced Trimension UWB Portfolio Hits the Road with Audi1. NXP's Trimension NCJ29Dx family of UWB fine-ranging ICs is used by Audi AG to enhance smart, hands-free secure car access functionality for the OEM's new Premium Platform Electric (PPE). 2. The Trimension NCJ29Dx family is designed to deliver robust, precise, and secure ranging and connectivity to meet the needs of global automotive OEMs. 3. The technology foundation for Audi's advanced new UWB platform, delivering precise and secure real-time localization for hands-free secure car access via smart mobile devices.
October 21
- Tower Semiconductor Announces Third Quarter 2024 Financial Results and Conference Call1. Tower Semiconductor will release its third quarter 2024 earnings release on November 13, 2024; 2. A conference call will be held on the same day at 10:00 a.m. Eastern Time to discuss financial results and fourth quarter guidance; 3. The call will be webcast and available for replay for 90 days.
October 15
- New S32J Family of Safe and Secure Ethernet Switches Enables Scalable Vehicle Networks, Extending NXP CoreRide Platform1. NXP introduces the new S32J family of high-performance Ethernet switches and network controllers; 2. The S32J family shares a common switch core with NXP's latest S32 microcontrollers and processors; 3. The S32J family meets time-sensitive networking (TSN) automotive standards and provides robust ASIL-D safety.
October 9
- ASM announces details of the Q3 2024 conference call and webcast1. ASM International will report its third quarter 2024 financial results on October 29, 2024; 2. The quarterly earnings conference call and webcast will be held on October 30, 2024; 3. Participants need to pre-register for the conference call and access the webcast.
September 24
- Axus Technology Delivers Industry’s Lowest Cost of Ownership for CMP Processes on 200mm SiC Wafers1. Axus Technology's Capstone CS200 platform offers the industry's lowest cost of ownership for CMP processes on 200mm SiC wafers. 2. It delivers twice the throughput and more than 50% lower total cost per wafer compared to leading CMP competitors. 3. The Capstone features a streamlined workflow and integrated cleaning capability, reducing process steps and lowering capex investment.
September 10
- Tower Semiconductor Sets a New RFSOI Standard with Broadcom’s Wi-Fi RF Front-End Modules for Next-Gen Mobile Applications1. Tower Semiconductor and Broadcom collaborate to produce Wi-Fi 7 RF FEMs based on Tower's advanced 300mm RFSOI technology. 2. The solution offers superior performance and efficiency compared to existing non-SOI technologies. 3. The partnership leverages Tower's RFSOI platform and Broadcom's RF FEM design expertise to deliver innovative solutions for advanced mobile applications.
- NXP Combines Ultra-Wideband Secure Ranging and Short-Range Radar to Enable Autonomous Industrial and IoT Applications1. NXP introduces the Trimension SR250, the first single-chip solution integrating short-range UWB radar and secure ranging. 2. The solution aims to enable new user experiences in autonomous homes and industrial IoT applications. 3. The Trimension SR250 supports 3D AoA, TDOA, and ToF, and can be combined with secure elements for added security.
September 4
- VIS and NXP Announce Establishment of VSMC Joint Venture1. VIS and NXP have established the VSMC joint venture after obtaining necessary approvals and injecting capital. 2. VSMC plans to construct a 300mm wafer fab in Singapore with an investment of approximately $7.8 billion. 3. The fab will support mixed-signal, power management, and analog products targeting automotive, industrial, consumer, and mobile markets, with initial production starting in 2027.
July 29
- ASM announces completion of share buyback program1. ASM International NV has completed its €150 million share buyback program, which started on May 15, 2024, and ended on July 25, 2024. 2. A total of 228,389 shares were repurchased at an average price of €656.77. 3. The company intends to reduce its capital by withdrawing the repurchased shares, except for those needed to fund employee and board member share and option programs.
July 25
- Allegro MicroSystems Announces Pricing of Primary Offering1. Allegro MicroSystems announced the pricing of a primary offering of 25 million shares at $24.00 per share, raising gross proceeds of $600 million. 2. The proceeds will be used to repurchase shares from Allegro's majority shareholder, Sanken Electric Co., Ltd. 3. The offering is expected to close on July 26, 2024, subject to customary closing conditions.
July 8
- ASM share buyback update July 1 – 5, 20241. ASM International NV reported share buyback transactions from July 1 to July 5, 2024. 2. A total of 3,350 shares were repurchased at an average price of €716.16, amounting to €2,399,144. 3. These repurchases are part of a €150 million share buyback program, of which 41.0% has been completed.
November 1
- Allegro MicroSystems Completes Acquisition of Crocus Technology to Accelerate Innovation in TMR Sensing Technology1. Allegro MicroSystems has completed the acquisition of Crocus Technology for $420 million, enhancing its TMR sensing technology capabilities. 2. The acquisition is expected to strengthen Allegro's position in the magnetic sensing market and drive broader adoption of TMR technology. 3. Funding for the acquisition was secured through a combination of cash on hand and a new seven-year $250 million senior secured term loan.
October 30
- Silicon Motion Announces Annual Cash Dividend Payable Quarterly1. Silicon Motion announces an annual cash dividend of $2.00 per ADS, to be paid quarterly. 2. The dividend payments will occur in four installments, each amounting to $0.50 per ADS. 3. The dividend program was reinstated after the termination of the proposed acquisition by MaxLinear.
October 23
- Tower Semiconductor Announces Third Quarter 2023 Financial Results and Conference Call1. Tower Semiconductor will release its Q3 2023 financial results on November 13, 2023. 2. A conference call to discuss these results and Q4 2023 guidance will be held on the same day. 3. The call will be webcasted and available for replay for 90 days.
October 12
- Allegro MicroSystems to Announce Second Quarter Fiscal Year 2024 Financial Results1. Allegro MicroSystems plans to release Q2 FY2024 financial results on November 2, 2023. 2. A conference call will be hosted by the President and CEO, Vineet Nargolwala, and the Senior VP and CFO, Derek D’Antilio, at 8:30 a.m. EDT. 3. The call will include discussion of the company's results and business outlook, with a live and archived webcast available on the company's website.
October 6
- Silicon Motion Announces Preliminary Third Quarter 2023 Revenue and Earnings Conference Call Details1. Silicon Motion expects its third quarter revenue to grow slightly above the high-end of its original guidance range of 15% to 20%. 2. The company will release its third quarter financial results on November 1 and host a conference call on November 2. 3. Participants must pre-register to join the conference call.
October 5
- Silicon Motion Files Notice of Arbitration Claim Against MaxLinear1. Silicon Motion Technology Corporation has initiated arbitration against MaxLinear, Inc. for breach of the Merger Agreement; 2. The claim seeks payment of a $160 million termination fee, further substantial damages, interest, and costs; 3. The arbitration proceedings are confidential under the SIAC Arbitration Rules.
July 11
- Allegro MicroSystems to Announce First Quarter Fiscal Year 2024 Financial Results1. Allegro MicroSystems plans to release Q1 FY2024 financial results on August 1, 2023. 2. A conference call will be hosted by the President and CEO, Vineet Nargolwala, and the Senior VP and CFO, Derek D’Antilio, at 8:30 a.m. EDT. 3. The conference call will include a discussion of the company's results and business outlook.
May 31
- Allegro MicroSystems to Present at Nasdaq's London Investor Conference1. Allegro MicroSystems announced its participation in the Nasdaq Investor Conference in London on June 13-14, in partnership with Jefferies. 2. Vineet Nargolwala, President and CEO, and Derek D’Antilio, CFO, will participate in a fireside chat on June 14. 3. A live and archived webcast of the event will be available on Allegro's Investor Relations page.
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