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April 24
- Fueling the EV Boom: The Quiet Technological Revolution Behind Charging
➀ The article highlights the quiet technological revolution happening behind the scenes of the electric vehicle (EV) boom, focusing on the importance of accurate electrical measurement for efficient and safe charging.
➁ It explains the two main architectures of EV charging: AC Charging (Level 1 and Level 2) for home and workplace use, and DC Charging (Level 3) for high-speed highway refueling.
➂ LEM, a Swiss company, provides essential current sensors and meters for both AC and DC charging architectures, ensuring safety, reliability, and accurate energy billing.
- Hybrid Material Doubles Thermoelectric Efficiency
➀ Researchers have developed a novel hybrid material that doubles thermoelectric efficiency by separating heat and electrical charge transport.
➁ The hybrid material combines an alloy of iron, vanadium, tantalum, and aluminum with a bismuth-antimony mixture, forming a compact structure that enhances energy conversion.
➂ This breakthrough could lead to more efficient energy harvesting in miniaturized electronics, especially for IoT devices, offering both performance and cost-effectiveness.
April 23
- “Molecular Spectroscopy Is Applicable To All Types Of PCBs” – Dr Atul Lavand, Thermo Fisher Scientific
➀ Dr. Atul Lavand from Thermo Fisher Scientific discusses the application of molecular spectroscopy in the semiconductor and electronics industry, particularly in PCB manufacturing and failure analysis.
➁ He highlights the importance of techniques like FTIR and Raman spectroscopy in identifying materials and contaminants in PCBs, aiding in process optimization and defect prevention.
➂ The interview also touches upon the role of artificial intelligence in enhancing spectral interpretation and future product innovations, along with the company's approach to supporting startups and SMEs in India.
- JOB: Embedded Hardware Engineer – FPGA Design At Digantara In Bengaluru
- JOB: Electrical Design HW Engineer At Schaeffler In Pune
- 1.5MP Global Shutter Sensor For Automotives
➀ OMNIVISION introduces the OX01N1B, a compact and cost-effective 1.5-megapixel global shutter image sensor for automotive driver monitoring systems (DMS).
➁ The sensor features advanced NIR technology with 36% NIR quantum efficiency, high MTF, low power consumption, and a compact 1/4.51-inch optical format.
➂ Integrated image processing and ASIL-B safety features make it suitable for next-generation in-vehicle safety systems, meeting regulatory requirements like those in Europe by 2026.
- JOB: Electronics Design Engineer At Eaton In Chennai
- JOB: Embedded Firmware Engineer At Anacle Systems India Pvt Ltd In Pune
- Flyback Reference Design For 48-V Car Battery
➀ The article introduces the TIDA-01344 reference design from Texas Instruments, a 24-W front-end power supply for 48-V automotive batteries.
➁ It supports a wide input range of 10 to 80 V DC and can handle transients up to 100 V, meeting the requirements of the LV148 automotive standard.
➂ The design eliminates the need for an optocoupler by using primary-side regulation, improving reliability and enabling a more compact PCB layout.
- World’s Smallest PPG Sensor Head
➀ SCIVAX Corporation and TSLC Corporation have jointly developed the world’s smallest PPG (PhotoPlethysmoGraphy) sensor head, measuring just 1 square millimeter in mounting area, which is 1/10th the size of traditional sensors.
➁ The compact design enables the sensor to fit into tight spaces, making it ideal for use in smartwatches and health devices with limited space.
➂ The new sensor head offers a lower production cost due to its single resin package design, including both the light source and the optical sensor, which can be used in arrays for multi-sensor applications in beauty care, home health, and nursing.
- Compact Wireless SoC With Memory And Power
➀ Silicon Labs has introduced the BG29 Series 2 wireless SoCs designed for ultra-compact Bluetooth Low Energy (LE) devices, offering high performance, robust connectivity, and extended memory without sacrificing size or power.
➁ The BG29 SoCs are available in QFN and WLCSP packages, making them suitable for small devices like smart implants, glucose monitors, and disposable wearables.
➂ Key features include 1 MB of Flash memory, 256 kB of RAM, integrated DCDC boost, and a Coulomb counter for accurate battery monitoring, ensuring extended battery life and enhanced security with Secure Vault High and Virtual Secure Engine.
April 22
- Embedded /Electronics Hardware Internship At Avon Building Solutions Private Limited In Pune
➀ This article announces an internship opportunity at Avon Building Solutions Private Limited in Pune, focusing on embedded systems and electronics hardware.
➁ The selected interns will work on designing electronic circuits, PCB design, collaborating on embedded system projects, troubleshooting, and researching new technologies.
➂ The internship offers a certificate, letter of recommendation, and potential job offers upon successful completion, with a potential annual salary range of ₹300,000 to ₹500,000.
- JOB: System Design Engineer At Siemens In Pune
- JOB: Analog Circuit Design Engineer At Intel In Bengaluru
- JOB: Production Engineer At Vishay Precision Group, Inc. (VPG) In Chennai
- JOB: Platform Hardware Design Engineer At Intel In Bengaluru
- Next-Gen Ti Graphics Cards
➀ ASUS has announced the launch of its latest graphics card lineup featuring NVIDIA's GeForce RTX 5060 and RTX 5060 Ti GPUs, available in both 8GB and 16GB versions. These GPUs are designed for superior performance in gaming and creative workflows.
➁ The GPUs are powered by NVIDIA’s Blackwell architecture and include advanced features such as DLSS 4 Super Resolution, Ray Reconstruction, and Multi Frame Generation, enabling stunning visuals and fluid performance.
➂ ASUS has equipped these cards with robust cooling solutions like Axial-tech fans, dual-ball fan bearings, and vented aluminum backplates, ensuring efficient heat dissipation and quiet operation.
- Low-Cost Optical Detection Using LDR Sensors
➀ Researchers have developed a cost-effective optical detection method for microfluidic devices using Light Dependent Resistors (LDRs), which could revolutionize point-of-care diagnostics and lab-on-a-disc platforms by enabling real-time fluid tracking without bulky, expensive hardware.
➁ The study introduces an optimized setup that pairs inexpensive LDRs with LEDs, improving the precision of these sensors by integrating them with custom-designed waveguides to reduce signal noise and detect subtle changes in fluid dynamics.
➂ Experiments demonstrated the system's capability to track fluid positions, droplet counts, and assess RBC deformability, showing potential in medical diagnostics and monitoring two-phase fluid interfaces in resource-limited settings.
- Industry’s First High-Power LTE-M/NB-IoT Module
➀ Ubiik introduces the Maverick 220, the world's first high-power LTE-M/NB-IoT module for private LTE networks, utilities, and industrial IoT.
➁ The module exceeds the industry standard of 23dBm by delivering up to 28dBm for LTE-M and 30dBm for NB-IoT, enhancing network coverage and reliability.
➂ Key features include support for TDD LTE-M, compatibility with existing LTE-M and NB-IoT standards, and optimized performance for narrow bandwidths.
- World’s First UCIe Optical Chiplet
➀ Ayar Labs has unveiled the world's first UCIe optical chiplet, designed to eliminate data bottlenecks, reduce latency, and cut power consumption while enabling interoperability between chiplets from different vendors.
➁ The TeraPHY chiplet offers 8 Tbps bandwidth and is powered by Ayar Labs' 16-wavelength SuperNova light source, making it suitable for scalable AI architectures.
➂ AMD supports the UCIe standard, recognizing its importance in driving innovation and meeting the needs of AI scale-up solutions.
April 21
- JOB: Application Engineer (BMS Hardware) At Johnson Controls In Pune
- JOB: FPGA Engineer At Algoquant In New Delhi
- SiC MOSFET Six-Pack Modules
➀ SemiQ Inc.推出了一款新的1200V SiC MOSFET六合一模块，专为电动汽车充电、能源存储、电机驱动和可再生能源平台等高需求应用设计；
➁ 模块集成了坚固的平面技术SiC MOSFET，具备低开关损耗、高功率密度及简化系统集成的特点；
➂ 产品支持连续漏极电流最高达30A，脉冲漏极电流可达70A，尺寸紧凑且可靠性高。
- Flexible Tandem Solar Cells Achieve 24.6% Efficiency
➀ Researchers from the Chinese Academy of Sciences have enhanced the efficiency and durability of flexible tandem solar cells by improving the bonding between layers.
➁ The perovskite top layer and CIGS bottom layer combination in these cells offers promise for lightweight, high-efficiency solar technology.
➂ After improvements, the flexible monolithic perovskite/CIGS tandem solar cell achieved a stabilized efficiency of 24.6%, showing strong mechanical durability and long-term stability.
- Tree Gum Powers Greener Supercapacitors
➀ Researchers have discovered a way to use a natural waste product from Indian trees to improve supercapacitors, potentially leading to more sustainable energy storage solutions.
➁ The gum kondagogu, secreted by the bark of the Cochlospermum gossypium tree, was combined with sodium alginate to create a protective layer that extends the lifespan of supercapacitors by preventing electrode corrosion.
➂ This breakthrough could significantly reduce electronic waste and enhance the efficiency of energy storage devices, marking a major step forward for green energy technology.
- AI-Powered Wearable Navigation
➀ Researchers have developed an AI-powered wearable system designed to help visually impaired individuals navigate obstacles safely and independently.;
➁ The system uses an AI algorithm to process real-time video from an onboard camera and provides navigational guidance through voice commands and haptic feedback.;
➂ Testing showed improved navigation abilities in complex environments, suggesting potential applications in other assistive technologies.
- Lead-Free Solder Paste For Advanced Assembly
➀ SHENMAO America, Inc. introduces PF606-P lead-free solder paste for the advanced 'Reverse Hybrid' assembly process, which enhances product reliability and increases manufacturing yields for cutting-edge electronics.
➁ The 'Reverse Hybrid' process combines SAC solder paste with BGA components featuring low-temperature solder (LTS) balls, resulting in a homogeneous SAC-LTS solder joint that improves thermal cycling and drop test performance.
➂ This method offers superior printability, solderability, and minimal voiding, making it ideal for next-generation advanced packages like CPUs, while maintaining standard SAC reflow conditions and simplifying integration.
- Power Relays For Military And Aerospace
➀ Microchip Technology has released new BR235 and BR235D series high-reliability power relays designed for military, space, and aviation applications. These relays are hermetically sealed and built to withstand rigorous conditions such as vibration, shock, and extreme temperatures.
➁ The relays feature robust electrical and mechanical endurance, supporting coil voltages from 6–48V DC and 115V AC, with various mounting and terminal options.
➂ Microchip emphasizes long-term supply stability and innovation for critical systems, ensuring reliable performance in demanding environments.