➀ G.Skill has introduced ultra-low-latency DDR5-6400 memory modules with CL30 timings, the most aggressive yet for DDR5-6400 sticks. ➁ These modules are designed for both AMD and Intel systems, offering a significant reduction in latency compared to JEDEC standards. ➂ The new memory kits will be available starting late August 2024, targeting high-end motherboards and properly cooled CPUs.

1. JEDEC is developing standards for DDR5 MRDIMMs and LPDDR6-based CAMMs. 2. MRDIMMs aim to double peak bandwidth to 12.8 Gbps and support more than two ranks. 3. LPDDR6 CAMMs will feature a new connector array to accommodate wider memory bus requirements.

1. KLEVV introduces FIT V DDR5 gaming memory with a sleek, ultra-low-profile design. 2. Available in 16GB and 32GB kits with speeds up to 6400MT/s. 3. Features include a built-in PMIC, multilayer PCB design, and support for Intel XMP 3.0 and AMD EXPO technology.

1. The desktop memory market is set to introduce a new type of DIMM called Clocked Unbuffered DIMM (CUDIMM) to enhance performance. 2. CUDIMMs address signal integrity challenges of DDR5 by adding a clock driver to the DIMM, improving stability and reliability at high speeds. 3. Standardized by JEDEC, CUDIMMs are designed for DDR5-6400 speeds and higher, and are compatible with existing platforms.

1. Minisforum announces new UM880 Pro and UM890 Pro Mini-PC systems with AMD's Ryzen 8000 series 'Hawk Point' APUs. 2. The UM880 Pro features the Ryzen 7 8845HS, while the UM890 Pro features the Ryzen 9 8945HS APU with up to 70W TDP. 3. The systems support up to 96GB DDR5-5600 memory, have multiple display and USB ports, and include an OCulink connector for external graphics. 4. The UM880 Pro starts at 2899 RMB, with a version including RAM and SSD starting at 3499 RMB.

1、G.Skill展示了一个DDR5内存模块，具有10,600 MT/s的数据传输率，这比现在流行的内存模块要高很多。 2、该模块使用AMD的Ryzen 5 8500G处理器和ASUS ROG Crosshair X670E Gene主板， cooling system是自定义的液冷系统。 3、G.Skill计划将这个模块用于未来市场，但还需要与各种CPU进行测试以确保稳定性。