1. TSMC achieves a breakthrough in 2nm semiconductor manufacturing using Gate-All-Around (GAA) transistor technology; 2. The new process offers 10-15% performance improvement and 25-30% power efficiency gains over 3nm chips; 3. Mass production is expected in 2025, positioning TSMC to lead advanced chip manufacturing for AI, HPC, and mobile devices.

1. TSMC is accelerating the development of its 2nm semiconductor process technology, with trial production planned for 2024 and mass production in 2025; 2. The company is increasing R&D investment and collaborating with ecosystem partners to enhance process performance and yield rates; 3. TSMC aims to maintain its competitive edge against rivals like Intel and Samsung in advanced semiconductor manufacturing.