<p>Hanwha Precision Machinery is on the verge of officially securing orders from SK Hynix for thermal compression (TC) bonders used in the production of high-bandwidth memory (HBM). Sources indicate that the equipment manufacturer is in the final stages of verification with the chip-maker.</p>
Related Articles
- SFA supplies inspection kit for HBM and glass substrates to major chipmakerabout 2 months ago
- DI subsidiary supplies inspection kit samples for HBM4 to SK Hynix2 months ago
- The Last of Us challenged the views of Nintendo's Miyamoto and God of War's Jaffe3 months ago
- Death Stranding 2 pre-orders 'are about to open' - physical edition details leaked3 months ago
- CEO Interview with Pradyumna (Prady) Gupta of Infinita Lab3 months ago
- Bug Hunting in Multi Core Processors. Innovation in Verification3 months ago
- Webinar: RF design success hinges on enhanced models and accurate simulation3 months ago
- Genesem supplies sorter for use in HBM testing to Korean chip giant3 months ago
- Palmer Luckey-founded Anduril inks huge US Army deal: 'turning soldiers into superheroes'4 months ago
- CEO Interview: Dr. Zeynep Bayram of 35ELEMENTS5 months ago