❶ The US government has announced the first recipients of the CHIPS and Science Act funding, awarding $300 million to three R&D facilities. ❷ These facilities include an NSTC Prototyping and NAPMP Advanced Packaging Piloting Facility, an NSTC Administrative and Design Facility, and an NSTC Extreme Ultraviolet (EUV) Center. ❸ The funding aims to bridge the gap between research and industry, revitalizing semiconductor R&D and addressing critical gaps in the current ecosystem.
Related Articles
- Strathclyde Uni gets £9m for IC packaging R&D2 months ago
- Imec and ASML sign five year R&D agreement3 months ago
- Repealing the CHIPS Act could dramatically shrink US chip market share, analysts say3 months ago
- Five point plan to boost UK semis5 months ago
- SEMI’s EU chip proposals6 months ago
- Intel’s Chips Act funding may be reduced6 months ago
- TSMC bags up $11.6bn Chips Act funding6 months ago
- Hemlock Semi gets $325m Chips Act funding7 months ago
- Wolfspeed wins $750m Chips Act award7 months ago
- Toppan Photomask rebrands as Tekscend8 months ago