➀ SK Hynix is scheduled to provide samples of its Gen 5 HBM, HBM3E 16H, in early 2025; ➁ The HBM3E 16H features 16 stacked DRAM dies and will utilize mass reflow molding technology; ➂ SK Hynix CEO Kwak Noh-jung announced this at an event hosted by SK Group.