➀ TSMC and Amkor have signed a MoU to provide advanced packaging and testing services in Arizona to expand the local semiconductor ecosystem; ➁ TSMC will adopt Amkor's turnkey advanced packaging and testing services at its new facility in Peoria, Arizona, to support its customers, particularly those with advanced wafer fabrication plants in Phoenix; ➂ The partnership aims to shorten the overall product production cycle by closely collaborating between TSMC's front-end wafer manufacturing factory in Arizona and Amkor's nearby back-end packaging and testing factory; ➃ Both companies will decide on the packaging technology to meet the capacity demand of their common customers, such as TSMC's InFO and CoWoS; ➄ The agreement highlights the commitment of both companies to support customers' regional flexibility requirements in front-end and back-end manufacturing, while fostering the local semiconductor manufacturing ecosystem.