➀ 3.5D packaging is emerging as a hybrid approach in the semiconductor industry, combining elements of 2.5D and full 3D-ICs. ➁ It addresses thermal dissipation and noise issues by creating physical separation between components. ➂ The approach allows for the integration of more SRAM, improving processing speeds and addressing the scaling limitations of SRAM. ➃ 3.5D also offers flexibility in adding processor cores and improves yield through the use of known good die. ➄ The technology is seen as a middle ground that balances performance improvements with manageable thermal and integration challenges.