<p>➀ TSMC's N3 process is expected to be a long-running and high volume node, referred to as 'the last and best finfet node' by Kevin Zhang, SVP for Business Development and Overseas Operations Office.</p><p>➁ The N3 process includes multiple variants such as N3B, N3E, N3P, N3X, N3S, N3RF, N3A, and N3C, each tailored for different applications.</p><p>➂ TSMC's strategy is to develop a comprehensive and customizable silicon resource with the N3 process, aiming to make integrated silicon performance a platform.</p>
Related Articles
- TSMC plans independent GigaFab cluster for Arizona7 months ago
 - TSMC to build 30% of its 2nm and more advanced chips in the U.S., to speed up Fab 21 build out7 months ago
 - Intel 18A running at 20-30% yields, says top analyst8 months ago
 - TSMC Invests 730 Billion Yuan in US Expansion, CEO Wei Zhejia Speaks, Trump Listens8 months ago
 - Intel Insider: Giving Wafer Fab Control to TSMC Would Be a Terrible Mistake!9 months ago
 - Intel principal engineer bemoans potential TSMC takeover, touts company's 18A tech advantage9 months ago
 - Suggestions for Intel's Wafer Fab10 months ago
 - Yield11 months ago
 - The 18A Enigma11 months ago
 - TSMC's 2nm Process Breakthrough: Key Information12 months ago