<p>➀ TSMC is scheduled to start producing 2nm GAA wafers in the fourth quarter of 2025 at its Fab 20 factory in Hsinchu, with a capacity of 30k wpm, followed by the Fab 22 factory in Kaohsiung, also with a capacity of 30k wpm, starting production in the first quarter of 2026.</p><p>➁ N2P production will begin at the end of 2026, but without the previously announced backside power delivery.</p><p>➂ The N2 and N2P processes will use TSMC's NanoFlex technology, allowing chip designers to mix and match units from different libraries (high-performance, low-power, area-efficient) on the same design.</p>