➀ Faraday and Kiwimoore announce the mass production of their jointly developed 2.5D packaging platform; ➁ The platform is a result of collaboration between the two companies; ➂ The platform is designed to enhance ASIC design and AI networking interconnect solutions.
Related Articles
- Nice detailed review of AMD’s chiplet technologyabout 1 month ago
 - China's 96-core x86 CPU taps chiplet design to rival AMD EPYC and Intel Xeon — 13 chiplets per processor provide up to 384 cores on a single motherboard, but no word on power consumptionabout 1 month ago
 - Alphawave Semi tapes out on TSMC 3nmabout 1 month ago
 - Solderless connections for leading-edge ICsabout 2 months ago
 - Advancing Semiconductor Design: Intel’s Foveros 2.5D Packaging Technologyabout 2 months ago
 - New Quantum Architecture Supports Lego Like Modular Designabout 2 months ago
 - TSMC increases Arizona internships to feed its Phoenix fabs — CHIPS-fueled supply chain begins to take shapeabout 2 months ago
 - 64Gbit/s die-to-die interconnect2 months ago
 - Chiplets: providing commercially valuable patent protection for modular products2 months ago
 - New Development: Modular Microrobots Capable of Communication and Cooperation2 months ago