Author page description
April 26
- ASML's Dilemma: High-NA EUV vs Low-NA EUV Multi-Patterning
➀ The cost model for low-NA and high-NA EUV is analyzed, revealing that high-NA EUV single patterning is more expensive than double-patterning with existing low-NA machines.
➁ Multi-patterning low-NA EUV can achieve finer pitch features than high-NA.
➂ ASML's goal of shipping 20 high-NA EUV tools by 2028 is considered ambitious and challenging due to economic and technological hurdles.
➃ The economic challenges of high-NA are more severe than those of low-NA, despite potentially smaller technical challenges.
➄ The development of high-NA EUV involves compromises, including technical challenges with half-field stitching, depth of focus, and photoresist, as well as cost challenges compared to existing low-NA tools.
➅ Low-NA double patterning is presented as a cost-effective alternative to high-NA EUV.