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October 3
- Semiconductor Super Sensor Boosts Sphere's Immersive Experience, Launching a New Era of Cinema➀ Infineon's super sensor technology is integrated into Sphere's immersive system; ➁ The technology enhances the sensory experience by capturing and processing environmental data; ➂ The integration of advanced sensors allows for real-time adjustments in the immersive environment.
October 1
- EDA’s Big Three Compare AI Notes with TSMC➀ The three major EDA toolmakers—Cadence, Synopsys, and Siemens EDA—are collaborating with TSMC on AI-driven design flows for advanced chip manufacturing nodes. ➁ IBM Research's Huiming Bu highlights the use of AI and machine learning in developing highly accurate lithography models. ➂ Synopsys' CEO Sassine Ghazi discusses Synopsys.ai's performance improvements and its impact on design and verification processes. ➃ Siemens EDA extends its AI collaboration with fabs like Intel Foundry and TSMC, introducing AI-accelerated simulators and Catapult AI NN software.
August 21
- Global's First RISC-V Core Super SIM Chip: Unlocking the Potential of Smart Security Cards➀ Introduces the CC2560A, the world's first RISC-V core super SIM chip, designed for multi-interface, high-security, and large-capacity smart card applications. ➁ Features a 32-bit RISC-V embedded security processor with a 120MHz clock speed, significantly enhancing transmission rates and computational power. ➂ Emphasizes advanced security measures including hardware-level encryption, EAL5+ certification, and support for international and national cryptographic algorithms.