1. Shin-Etsu Chemical has developed a new equipment for manufacturing semiconductor packaging substrates using a high-performance processing device with excimer laser, applying the dual damascene method from front-end semiconductor manufacturing to back-end processes. 2. This method integrates the interposer function directly into the packaging substrate, eliminating the need for interposers and enabling finer processing not possible with traditional methods. 3. The approach also reduces costs and capital investment by eliminating the photoresist process in the packaging substrate manufacturing process.

1. Shin-Etsu Chemical Co., Ltd. has developed equipment for producing substrates for semiconductor packages using a new manufacturing method. 2. This development follows the production system for micro-LEDs. 3. The equipment features a high-performance processing system utilizing an excimer laser with a dual damascene structure.

1. Shin-Etsu Chemical Co. Ltd. has developed a facility for manufacturing semiconductor package substrates using a new production method, which is subsequently used in the production of micro-LED manufacturing systems. 2. The facility is a high-performance processing plant that operates with an Excimer laser and employs the Dual-Damascene method.

1. Shin-Etsu Chemical has developed new equipment for manufacturing semiconductor package substrates, following their micro-LED manufacturing system. 2. The equipment utilizes an excimer laser and employs a dual damascene method, similar to that used in the front end of semiconductor manufacturing. 3. This development aims to enhance the back end process of semiconductor manufacturing.