➀ Manz, a semiconductor equipment manufacturer, has delivered 300/510/600/700mm panel-level packaging RDL production lines to multiple international clients. ➁ The company emphasizes the importance of panel-level packaging due to its higher area utilization and lower production costs, especially in the context of growing AI server demands. ➂ Manz is focusing on advancing RDL technology, particularly in high-density glass and diversified chemical processes, to meet the increasing requirements for advanced 2.5D and 3D packaging.