➀ The Dragon Eagle One, a 7nm automotive-grade intelligent cabin chip, was unveiled at the Frankfurt Motor Show, alongside Geely's Galaxy E5 pure electric SUV. It was the chip's second international showcase after the CES in the US. ➁ The chip, designed by Hubei Xincheng Technology Co., Ltd., based in Wuhan's Economic and Technological Development Zone, features 87 layers of circuits and 8.8 billion transistors. ➂ It took only 18 months for the chip to go from concept to mass production, a process that typically takes 3 to 5 years. ➃ The chip, with two NPUs (embedded neural network processors), significantly enhances computing power, making it ideal for 'cabin-parking integration'. ➄ To date, the chip has been shipped to over 400,000 units and has been installed in more than 20 models, including the popular Leiking 08.

➀ The configuration level of intelligent cabins has become an important reference for consumers when buying cars. The article discusses the increasing hardware resource and computing power requirements of intelligent cabins, which are met by high-performance SoC chips. In 2023, the domestic market delivered 3.476 million sets of cabin domain controllers, with an installation rate of 16.5%. Foreign chip brands still dominate the market, with Qualcomm alone accounting for nearly 60% of the market share. ➁ Consumer electronics chip manufacturers have an advantage in the intelligent cabin SoC market due to their cost and iteration speed advantages. ➂ The market share of intelligent cabin SoC chips is concentrated in a few overseas chip companies, including Qualcomm, AMD, Renesas, Intel, and Samsung. Currently, the market share of domestic cabin SoC chips is not high, accounting for less than 10%, mainly due to the late start of domestic manufacturers.