1. TSMC's SoIC advanced packaging technology faces surging demand, with orders extending to 2027; 2. Major clients include Apple, NVIDIA, and AMD, driving capacity expansion plans; 3. The technology supports next-gen AI/HPC chips with 3D stacking innovation.

1. TSMC develops innovative microchannel liquid cooling and 3D packaging technologies to address heat dissipation challenges in advanced chips; 2. The breakthrough enhances chip performance and energy efficiency for AI and high-performance computing applications; 3. The technology could redefine thermal management in future electronics and support sustainable semiconductor development.