1. Super Micro has overcome accounting concerns and is poised to thrive with U.S. hyperscalers driving AI data center spending; 2. Despite a sales hit from the 10-K delay, the AI server company guided FY25 revenues to $23.5 to $25.0 billion, with a potential target of $40 billion in FY26; 3. Super Micro raised $700 million via a convertible debt offering, signaling a return in investor confidence.
Recent #数据中心 news in the semiconductor industry
➀ AMD launches its latest AI chip, server CPU, AI network card, DPU, and AI PC mobile processor; ➁ The flagship AI chip, AMD Instinct MI325X GPU, achieves a peak AI computing power of 21PFLOPS with HBM3E high-bandwidth memory; ➂ The new EPYC server CPU is powered by TSMC's 3/4nm process, with up to 192 cores and 384 threads, and priced at 14813 USD per unit; ➃ AMD EPYC 9575F processor offers up to 2.7 times the performance improvement over its predecessor in SPEC CPU tests; ➄ AMD's third-generation commercial AI mobile processor, Ryzen AI PRO 300 series, is designed for next-generation enterprise AI PC.
➀ IBM introduces the Telum II processor with AI acceleration capabilities, designed for large-scale machine learning and large language models. ➁ FuriosaAI unveils the RNGD, a Tensor Contraction Processor (TCP) optimized for high-performance, efficient large language model inference in data centers. ➂ RNGD features a 5nm process, 40 billion transistors, and supports up to 512TFLOPS (FP8) and 1024TOPS (INT4) with a TDP of only 150W, significantly lower than typical gaming GPUs.