<p>➀ The approved IC design companies and semiconductor packaging and testing companies are mainly from Europe, the United States, and Taiwan, indicating a clear intention to decouple technology. It is necessary to build a complete and independent domestic electronic information industry chain.</p><p>➁ The requirement for sensitive chip outsourcing and the use of designated packaging and testing companies show that packaging and testing will be the next target of US suppression. It is necessary to enhance wafer manufacturing and packaging and testing capabilities, ensuring close cooperation among design, manufacturing, and packaging and testing companies.</p><p>➂ The safety of nodes above 16/14nm, such as 20nm and 28nm, will not be a concern as long as a complete and independent industry chain is formed.</p><p>➃ It is necessary to ensure the sufficient supply of 16/14nm process technology as soon as possible to avoid affecting the upgrade of many products.</p><p>➄ Short-term focus on technology optimization and capacity expansion of mature processes such as 28nm, and medium to long-term breakthroughs in special processes such as automotive chips and the third generation of semiconductor. In addition, accelerate the research and development of new materials and new architectures, such as SiC/GaN, computing-in-memory chips, and silicon photonics chips.</p>