<p>➀ The majority of SiC devices are currently produced on 150mm wafers, with larger wafers posing significant challenges.</p><p>➁ Infineon has made significant progress in its 200mm SiC roadmap, releasing the first products based on advanced 200mm SiC technology in the first quarter of 2025.</p><p>➂ These products manufactured in Austria, provide top-tier SiC power technology for high-voltage applications such as renewable energy, trains, and electric vehicles.</p>
Related Articles
- Infineon adds thermally optimised CoolSiC MOSFETabout 1 month ago
- SiC’s growth opportunities2 months ago
- USB Cameras With Enhanced Speed And Performance3 months ago
- Capacitive touch sensing in direct-to-battery automotive MCU3 months ago
- Lead times continue to stabilise, says Sourceability3 months ago
- Full-Bridge 600 W Isolated DC-DC Reference Design3 months ago
- Most Read – GaN micro-LEDs, Rivian contract, Nvidia’s Blackwell Ultra4 months ago
- Nvidia and Infineon to establish new architecture for power chips in AI datacentres4 months ago
- Two-Way GaN Switch For Power Systems4 months ago
- Infineon expects FY revenue decline4 months ago