<p>➀ SK Hynix unveiled a UFS 4.1 storage solution using 321-layer 4D NAND flash, marking the industry's highest layer count; </p><p>➁ It delivers 4300MB/s read speed, 15%-40% faster random operations, 7% power efficiency improvement, and ultra-thin 0.85mm design for AI smartphones; </p><p>➂ The 1Tb TLC chip will expand to SSDs, strengthening SK Hynix's position as a full-stack AI memory provider.</p>
Related Articles
- SK hynix dethrones Samsung to become world's top-selling memory maker for the first time — success mostly attributed to its HBM3 dominance for Nvidia's AI GPUs16 days ago
- Prototype of a Particularly Sustainable and Energy-Autonomous E-Bike Terminal Developed at HKA4 months ago
- White Knight to save Shibaura4 months ago
- Ed Rides The Tariff Roller-Coaster4 months ago
- Image Acquisition Software Launch for Centralized Control of NanoZoomer® MD Series4 months ago
- Trump creates U.S. Investment Accelerator to manage CHIPS Act and 'negotiate much better deals'5 months ago
- Contactless Timing for Paralympic Swimming5 months ago
- 2% 2025 growth forecast for front-end fab equipment5 months ago
- Fishing5 months ago
- Ed Tackles PIP5 months ago