<p>➀ Researchers at Science Tokyo developed BBCube - a 3D chip stacking architecture enabling direct DRAM-xPU integration with 10μm chip gaps and 10ms/chip bonding;</p><p>➁ Innovations include inkjet-based COW bonding, heat-resistant DPAS300 adhesive, and embedded capacitors for power delivery;</p><p>➂ Reduces data transmission energy by 80-95% compared to traditional 2D systems, promising breakthroughs for AI accelerators and edge devices.</p>